Smart wheel energy harvester

ABSTRACT

Systems and methods for an energy harvester proximate to a rotatable component of a vehicle&#39;s wheel are disclosed. In some embodiments, an energy harvester system includes: a substrate having a first surface configured to contact and interface with a surface of a wheel, and a second surface opposite the first surface; a piezoelectric component configured to produce energy in response to mechanical strain imparted on the piezoelectric component, wherein the piezoelectric component is configured to deform while experiencing the mechanical strain so as to contact at least a portion of the second surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority benefit of U.S. ProvisionalApplication No. 62/878,225, filed on Jul. 24, 2019, the contents ofwhich are incorporated by reference in its entirety.

TECHNICAL FIELD

This application relates generally to sensor systems and, moreparticularly, relates to systems and methods for an energy harvesterproximate to a rotatable component of a vehicle's wheel.

BACKGROUND

In the area of automotive sensor systems, the demand for advancedsensing applications to complement existing electronic safety systemshas drawn considerable attention. This includes, for example,measurements of temperature, pressure, acceleration, and forces (staticand dynamic) acting on a tire, wheel and car. All these sensors createan increased power demand to operate and transmit data more frequently.Current power sources (e.g., lithium ion batteries) driving thesesensors are limited in their capacity and exhibit drawbacks such as lowdurability, difficulty of replacement, and most notably, inferiorsustainability in terms of environmental impact. With increased powerload, these power sources are further subjected to accelerated dischargecycles, resulting in frequent or premature replacement of entire sensormodules. This may increase the overall cost of ownership and maintenanceto a user.

The foregoing examples of the related art and limitations relatedtherewith are intended to be illustrative and not exclusive. Otherlimitations of the related art will become apparent upon a reading ofthe specification and a study of the drawings.

SUMMARY

The exemplary embodiments disclosed herein are directed to solving theissues relating to one or more of the problems presented in the priorart, as well as providing additional features that will become readilyapparent by reference to the following detailed description when takenin conjunction with the accompanied drawings. In accordance with variousembodiments, exemplary systems, methods, devices and computer programproducts are disclosed herein. It is understood, however, that theseembodiments are presented by way of example and not limitation, and itwill be apparent to those of ordinary skill in the art who read thepresent disclosure that various modifications to the disclosedembodiments can be made while remaining within the scope of theinvention.

In certain embodiments, a system includes: a substrate comprising: afirst surface curved in three dimensions, where the first surface isconfigured to interface with a rim of a wheel, and a second surfacecurved in at least two of the three dimensions; and a piezoelectriccomponent configured to produce energy in response to mechanical strain,where the piezoelectric component is in contact with the wheel, andwhere the piezoelectric component is configured to deform and contactthe second surface while experiencing the mechanical strain.

In certain embodiments, the piezoelectric component comprises multiplelayers.

In certain embodiments, the piezoelectric component comprises: a tensileload backing layer, a piezoelectric material layer, and an electrodelayer.

In certain embodiments, the electrode layer comprises an electrodeconfigured to connect to an interconnect.

In certain embodiments, the electrode is formed as a mesh.

In certain embodiments, the electrode layer is closer to the secondsurface than the tensile load backing layer.

In certain embodiments, the piezoelectric material layer is between thetensile load backing layer and the electrode layer.

In certain embodiments, the three dimensions are along a length, awidth, and a height of the substrate.

In certain embodiments, a system includes: a wheel comprising a stagingsurface curved in only two dimensions; and a piezoelectric componentconfigured to produce energy in response to mechanical strain, where thepiezoelectric component is flat and in contact with the wheel, and wherethe piezoelectric component is configured to deform and contact thestaging surface while experiencing the mechanical strain.

In certain embodiments, the wheel includes a rim, where the stagingsurface is part of a depression along the rim.

In certain embodiments, the piezoelectric component comprises apiezoelectric material layer between two electrode layers.

In certain embodiments, the two electrode layers comprise different meshstructures.

In certain embodiments, the piezoelectric component is configured toconform with the staging surface while experiencing the mechanicalstrain.

In certain embodiments, the piezoelectric component comprises apiezoelectric material that is at least one of: a crystal andsemiconductor material or a polymer and organic material.

In certain embodiments, the wheel comprises an airless tire and thestaging surface is along a spoke of the airless tire.

In certain embodiments, a method includes: rotating a wheel, where thewheel comprises a staging surface curved in only two dimensions;deforming a piezoelectric component, where the piezoelectric componentconfigured to produce energy in response to mechanical strain, where thepiezoelectric component is flat and in contact with the wheel, and wherethe piezoelectric component is configured to deform and contact thestaging surface while experiencing the mechanical strain; and powering adevice located on the wheel using the energy.

In certain embodiments, the method further includes: receiving, at aprocessor located within a vehicle body, sensor data from the device,where the device is configured to produce sensor data while disposed onthe wheel; determining a parameter value based on the sensor data; andperforming an action based on the parameter value meeting a thresholdvalue.

In certain embodiments, the parameter value is based on the sensor dataand data received from a remote server.

In certain embodiments, the device is configured to send the sensor datato the processor via a wireless connection.

In certain embodiments, the piezoelectric component is configured tocontact a surface on which the wheel is configured to rotate.

BRIEF DESCRIPTION OF THE DRAWINGS

Various exemplary embodiments of the invention are described in detailbelow with reference to the following Figures. The drawings are providedfor purposes of illustration only and merely depict exemplaryembodiments of the invention. These drawings are provided to facilitatethe reader's understanding of the invention and should not be consideredlimiting of the breadth, scope, or applicability of the invention. Itshould be noted that for clarity and ease of illustration these drawingsare not necessarily drawn to scale.

FIG. 1 is a diagram of a smart wheel sensor system that integrates atleast one smart wheel, in accordance with various embodiments.

FIG. 2 is a block diagram of an exemplary computing device, inaccordance with various embodiments.

FIG. 3A is a perspective illustration of a smart wheel, in accordancewith various embodiments.

FIG. 3B is a perspective illustration of the smart wheel without theflexible component, in accordance with various embodiments.

FIG. 4A is a perspective illustration of the energy harvester, inaccordance with various embodiments.

FIG. 4B is a top view illustration of the energy harvester, inaccordance with various embodiments.

FIG. 4C is a front view illustration of the energy harvester, inaccordance with various embodiments.

FIG. 4D is a back view illustration of the energy harvester, inaccordance with various embodiments.

FIG. 4E is a bottom view illustration of the energy harvester, inaccordance with various embodiments.

FIG. 4F is a right side view illustration of the energy harvester, inaccordance with various embodiments.

FIG. 4G is a left side view illustration of the energy harvester, inaccordance with various embodiments.

FIG. 5A is a side cross sectional view of the energy harvester with thepiezoelectric component in an unbiased state, in accordance with variousembodiments.

FIG. 5B is a side cross sectional view of the energy harvester with thepiezoelectric component 404 in a biased state, in accordance withvarious embodiments.

FIG. 6 is a perspective illustration of an integrated energy harvester,in accordance with various embodiments.

FIG. 7A illustrates different layers of a piezoelectric component, inaccordance with various embodiments.

FIG. 7B illustrates the piezoelectric component in an assembled form, inaccordance with various embodiments.

FIG. 8A is a perspective illustration of the energy harvester with apiezoelectric component secured at one end to a substrate, in accordancewith various embodiments.

FIG. 8B is a perspective illustration of the substrate without thepiezoelectric component, in accordance with various embodiments.

FIG. 9A illustrates an exemplary mesh formation of an electrode as astraight winding, in accordance with various embodiments.

FIG. 9B illustrates an exemplary mesh formation of an electrode as acurved winding, in accordance with various embodiments.

FIG. 9C illustrates an exemplary mesh formation of an electrode as azig-zag winding, in accordance with various embodiments.

FIG. 9D illustrates an exemplary mesh formation of an electrode as a onesided bowled winding, in accordance with various embodiments.

FIG. 9E illustrates an exemplary mesh formation of an electrode as a twosided bowled winding, in accordance with various embodiments.

FIG. 9F illustrates an exemplary mesh formation of an electrode as asharp winding, in accordance with various embodiments.

FIG. 9G illustrates an exemplary mesh formation of an electrode as apartial curved winding, in accordance with various embodiments.

FIG. 9H illustrates an exemplary mesh formation of an electrode as adeep curved winding, in accordance with various embodiments.

FIG. 9I illustrates an exemplary mesh formation of an electrode as agrid, in accordance with various embodiments.

FIG. 9J illustrates an exemplary mesh formation of an electrode as abackslash grid, in accordance with various embodiments.

FIG. 9K illustrates an exemplary mesh formation of an electrode as aforward slash grid, in accordance with various embodiments.

FIG. 9L illustrates an exemplary mesh formation of an electrode as aback and forward slash grid, in accordance with various embodiments.

FIG. 9M illustrates an exemplary mesh formation of an electrode as alooping winding, in accordance with various embodiments.

FIG. 9N illustrates an exemplary mesh formation of an electrode as apointed winding, in accordance with various embodiments.

FIG. 9O illustrates an exemplary mesh formation of an electrode as acomplex looped winding, in accordance with various embodiments.

FIG. 9P illustrates an exemplary mesh formation of an electrode as a twosided segmented bowled winding, in accordance with various embodiments.

FIG. 9Q illustrates an exemplary mesh formation of an electrode as amonolith, in accordance with various embodiments.

FIG. 10A illustrates a ring formation of energy harvesters with anactive/passive bank feature, in accordance with various embodiments.

FIG. 10B illustrates a ring formation of energy harvesters with aninterlocking feature, in accordance with various embodiments.

FIG. 10C illustrates disconnected energy harvesters of the ringformation of energy harvesters with an interlocking feature, inaccordance with various embodiments.

FIG. 10D illustrates connected energy harvesters of the ring formationof energy harvesters with an interlocking feature, in accordance withvarious embodiments.

FIG. 10E illustrates connected energy harvesters of a continuous ringformation, in accordance with various embodiments.

FIG. 11A illustrates a plan cross sectional view of an energy harvesterenergy connector that runs within a tire, in accordance with variousembodiments.

FIG. 11B illustrates a plan cross sectional view of an energy harvesterenergy connector that runs within a rotatable component, in accordancewith various embodiments.

FIG. 12A illustrates an energy harvester disposed on a spoke of anairless tire, in accordance with various embodiments.

FIG. 12B illustrates an energy harvester disposed on a joint of thespoke of an airless tire 1206, in accordance with various embodiments.

FIG. 12C illustrates an energy harvester disposed around a terminusregion of the spoke 1204 of the airless tire, in accordance with variousembodiments.

FIG. 13A illustrates an energy harvester disposed on a spherical wheel,in accordance with various embodiments.

FIG. 13B illustrates energy harvesters disposed on a spherical wheel ina band formation, in accordance with various embodiments.

FIG. 14 is a flow chart of an energy harvester process, in accordancewith various embodiments.

FIG. 15 is a flow chart of a smart wheel process, in accordance withvarious embodiments.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Various exemplary embodiments of the invention are described below withreference to the accompanying figures to enable a person of ordinaryskill in the art to make and use the invention. As would be apparent tothose of ordinary skill in the art, after reading the presentdisclosure, various changes or modifications to the examples describedherein can be made without departing from the scope of the invention.Thus, the present invention is not limited to the exemplary embodimentsand applications described and illustrated herein. Additionally, thespecific order or hierarchy of steps in the methods disclosed herein aremerely exemplary approaches. Based upon design preferences, the specificorder or hierarchy of steps of the disclosed methods or processes can berearranged while remaining within the scope of the present invention.Thus, those of ordinary skill in the art will understand that themethods and techniques disclosed herein present various steps or acts ina sample order, and the invention is not limited to the specific orderor hierarchy presented unless expressly stated otherwise.

As noted above, batteries or other disposable energy sources poweringvehicular sensor systems are limited in their capacity and exhibitdrawbacks such as low durability, difficulty of replacement, andinferior environmental sustainability. An alternative to disposablebatteries in vehicular sensor systems involves harvesting energy fromthe environment. Accordingly, new systems and methods utilizing energyharvesters for harvesting energy from an environment proximate to awheel are disclosed herein, in accordance with various embodiments.These energy harvesters may be devices that transform energy fromvarious sources such as kinetic energy, heat, light, and/or mechanicalenergy into usable electrical energy, in accordance with variousembodiments. For example, an energy harvester may utilize piezoelectrictransduction to transform tire deformations into electrical energy. Thisamount of energy transformation may vary based on a rotating speed of awheel (e.g., a speed of the car as determined by a driver). Also, incertain embodiments, energy harvesters may be placed on a rim of a wheelfor more effective energy capture.

In various embodiments, an energy harvester may produce sustainedoutputs at varying vehicle speeds based on the weight of the vehicleacting on an underlying surface (e.g., a road) through a rim and tire.For example, vehicles may have wheels (e.g., wheels with pneumatictires). A wheel, with an inflated tire and rigid rim, can exchangevehicular actions along a bead area of the tire that interfaces with therigid rim. These vehicular actions may include traction, braking,steering, load support, and the like. As the wheel rotates, the lowerpart of the tire may apply forces in the bead area to counter the weightof the car. These forces may cause sidewalls of the wheel to bend due tothe internal air pressure of the tire (e.g., due to the intimate contactbetween a rubber tire and metal rim).

In various embodiments, an energy harvester may include a substrate anda piezoelectric component. The substrate may be placed behind (e.g.,proximate to) the piezoelectric component to form a cavity that allowsthe force of the vehicle during motion (e.g., wheel rotation) todisplace (e.g., strain or bend) the piezoelectric component and generatea charge (e.g., electrical energy). The energy harvester, as apiezo-substrate assembly, can then be arrayed around the circumferenceof the rim, generating continuous power as the wheel rotates. In certainembodiments when the energy harvester is mounted on the rim of thewheel, the energy harvester may be separate from the rim and/or thetire. Thus, the energy harvester need not be replaced or changed whenthe tire is replaced. The energy harvester may also be coupled with anenergy storage device (e.g., a rechargeable battery) to provide rechargecycles that can supply power to an array of sensors placed in, on, orproximate to the wheel.

In some embodiments, a piezoelectric component may utilize strain (e.g.,mechanical strain indicative of relative motion/deflection) to generatecharge. Furthermore, the substrate may be structured to facilitate theexpression of the strain (e.g., relative motion/deflection) of thepiezoelectric component when placed between the tire and rim of a wheel.

In various embodiments, the substrate may include a geometry and belocated in a power dense area of a wheel to increase strain (e.g.,energy generation) from a piezoelectric component mounted on thesubstrate. Stated another way, an energy harvester may be a mechanismwith a specific internal and external geometry sitting between a wheeland tire that transforms mechanical force (vehicle weight) andlocomotion into usable strain generated on a piezoelectric component.

In certain embodiments, an energy harvester may harvest energy frommechanical loads exerted upon a wheel. For example, the load of thevehicle and the force exerted by the vehicle in the presence of amechanical substrate may induce a strain on a piezoelectric componentthat produces substantial power which can be harnessed to powerelectronic or sensing systems in the vehicle and/or wheel.

This energy harvester, inclusive of the piezoelectric component andsubstrate in certain embodiments, may be modular and scaled to variouswheel diameters, energy requirements, and sensor locations. In furtherembodiments, this substrate may encase and protect a piezoelectriccomponent mounted on the substrate and other electronics fromdegradation due to exposure. In yet further embodiments, the energyharvester may include the piezoelectric component and a region of awheel (e.g., a staging surface) configured or constructed to inducestrain upon the piezoelectric component.

In various embodiments, the substrate may include a three-dimensionalcurved bottom surface that interfaces with a rim (e.g., a rotatablecomponent of a wheel separate from a tire (e.g., a flexible component)of a wheel). This three-dimensional curved bottom surface may include acompound curve in three dimensions (e.g., length, height, and width).Each of the length, height, and width may define dimensions or axesorthogonal to each other in three dimensional physical space. Forexample, the length may be along an axis orthogonal to the height, whichmay be along an axis orthogonal to the width, which may be along an axisorthogonal to the length. In certain embodiments, the length, height,and width may be referred to as an x-axis, a z-axis, and a y-axis. Also,the substrate may include a two-dimensional (e.g., two of a length, aheight and a width) curved staging surface (e.g., a micro cavity ordepression) opposite a bottom surface of the substrate. In certainembodiments, this two dimensional curved staging surface may be curvedin a convex or concave manner and the piezoelectric component may incurstrain to deform and conform to the two dimensional curved stagingsurface. Accordingly, the rectangular piezoelectric component may beconfigured to bend and conform to the two dimensional curved stagingsurface while sitting on the rim via the three-dimensional curved bottomsurface (e.g., by being secured on the substrate with thethree-dimensional curved bottom surface).

In certain embodiments, the piezoelectric component may be formed withmultiple layers. For example, the piezoelectric component may include atensile load backing layer. This tensile load backing layer may be, forexample, a steel plate with sufficient tensile load flexibility to keepthe piezoelectric component together. The piezoelectric component mayfurther include a central piezoelectric material layer that may beconfigured to generate electrical charge when it is mechanicallydeformed. The piezoelectric component may further include an electrodelayer that may be formed as a mesh with the central piezoelectricmaterial layer to more effectively harvest electrical charge from thecentral piezoelectric material layer. In particular embodiments, anelectrode layer may include an electrode embedded within (e.g., held inplace by) a flexible material (e.g., epoxy) and in direct or indirectcontact with the piezoelectric material layer.

In certain embodiments, an electrode layer may include a flexibleinterconnect with an electrode. Also, the electrode layer may contain aflexible material that keeps the electrode and flexible interconnect inplace. This flexible interconnect may be configured to electricallyconnect the electrode in the electrode layer to other electricalcomponents (e.g., a pressure sensor) coupled to the wheel in order toprovide power to the other electrical components or for the otherelectrical components to perform measurements based on signals receivedfrom the flexible interconnect.

In certain embodiments, this lower electrode layer may be closest to thestaging surface and may touch the staging surface when the piezoelectriccomponent is biased (e.g., strained or deformed) to conform to thetwo-dimensional curved staging surface. Accordingly, the centralpiezoelectric material layer may be sandwiched (e.g., in between) thelower electrode layer and the tensile load backing layer. In particularembodiments, the piezoelectric component may be referred to as apiezoelectric element.

In certain embodiments, the piezoelectric component may include threelayers, including a tensile load backing layer, which is connected to acentral piezoelectric material layer, which is connected to a lowerelectrode layer. In various embodiments, the electrode layer may beassociated with two independent circuits (e.g., so that the lowerelectrode layer may represent a difference in voltage potential betweenthe two independent circuits) when the piezoelectric component includesonly a single electrode layer. In particular embodiments, the lowerelectrode layer may be closest to the staging surface among the layersof the piezoelectric component. However, in other embodiments, thetensile load backing layer may be closest to the staging surface amongthe layers of the piezoelectric component.

In specific embodiments, an upper electrode layer may be formed on(e.g., adhered to) the tensile load backing layer. For example, theupper electrode layer may be the furthest from the staging surface andthe lower electrode layer may be the closest to the staging surfaceamong the layers of the piezoelectric component. In particularembodiments, this upper electrode layer may also be formed as a mesh onthe tensile load backing layer to harvest electrical charge from thepiezoelectric material layer (e.g., via the tensile load backing layerbetween the upper electrode layer and the piezoelectric material layer).Accordingly, the piezoelectric component in certain embodiments mayinclude four layers, with an upper electrode layer, which is connectedwith a tensile load backing layer, which is connected with a centralpiezoelectric material layer, which is connected with a lower electrodelayer. Although certain embodiments may describe the lower electrodelayer as closest to the staging surface among the layers of thepiezoelectric component, other embodiments may describe the upperelectrode layer as closest to the staging surface among the layers ofthe piezoelectric component. In certain embodiments, the piezoelectriccomponent may also be referred to as a piezoelectric electrode assembly.In various embodiments, a piezoelectric component may include twoelectrode layers that may have a relative electric potential differencebetween each other.

In particular embodiments, the tensile load backing layer may beelectrically and mechanically bonded to a piezoelectric material layer.As noted above, the tensile load backing layer may be made of stainlesssteel. Also, the piezoelectric material layer may be referred to as apiezoelectric wafer in certain embodiments. Also, the top electrodelayer and the bottom electrode layer may be electrically bonded to thetensile load backing layer and piezoelectric material layer,respectively. For example, the top electrode layer may be electricallybonded to the tensile load backing layer and the bottom electrode layermay be electrically bonded to the piezoelectric material layer.

In various embodiments, a piezoelectric component may be assembledagainst a convex surface of a substrate. As noted above, the substratemay include a two-dimensional curved staging surface. Thistwo-dimensional curved staging surface may include a convex surface towhich the piezoelectric component, with a straight (e.g., non-curved orflat) shape or surface when in a resting state, may be attached. When astrain or force is applied to the piezoelectric component, it will bendand conform to the two-dimensional curved staging surface. In certainembodiments, the substrate may be referred to as a teardrop support.Also, in various embodiments, a piezoelectric component may be attachedto the convex surface of the substrate in a manner such that thepiezoelectric material layer is closer to the substrate than the tensileload backing layer. Stated another way, piezoelectric component may beattached to the convex surface of the substrate such that thepiezoelectric material layer is facing down toward the convex surface.

In various embodiments, a piezoelectric component may be bent againstthe convex surface to generate compressive bending strain on thepiezoelectric component. Stated another way, the piezoelectric componentmay incur strain such that the piezoelectric component is bent toconform to the convex surface to generate electrical charge (e.g., viapiezoelectric material layer mechanical deformation). Accordingly, thesubstrate may be structured to enable a strain (e.g., relativemotion/deflection) of the piezoelectric component when placed betweenthe tire and rim of a wheel (e.g., by the tire pushing down against thepiezoelectric component).

The mesh formation of an electrode layer (e.g., an upper electrode layerand/or lower electrode layer) may be in any configuration or structure,such as by being simply connected (e.g., without any openings or holes)in certain embodiments or by not being simply connected (e.g., withopenings or holes) in other embodiments. In particular embodiments, themesh formation of the electrode layer may be a single elongatedelectrode that traverses a two-dimensional space (e.g., along a surfaceof another layer of the piezoelectric component). Accordingly, theelectrode layer may be a layer of the piezoelectric component thatincludes an electrode generally held in place by a flexible material(e.g., an epoxy) and is connected with a flexible interconnect. Inalternative embodiments, an electrode layer (e.g., an upper electrodelayer and/or lower electrode layer) may be monolithic (e.g., be a solidlayer of electrode coextensive with a surface of another layer of thepiezoelectric component). In further embodiments, different electrodelayers may include different mesh formations. In yet furtherembodiments, different electrode layers may include the same meshformations.

In various embodiments, the piezoelectric component may be adapted toincur strain (e.g., generate energy) in any type of wheel in which force(e.g., to produce strain) is applied during rotation. Examples ofdifferent types of wheels may include wheels with an air-inflated tire,wheels with an airless tire (e.g., a non-pneumatic or flat-free tire),wheels that are cylindrical, and wheels that are spherical. Inadditional embodiments, a piezoelectric component may be adhereddirectly to a wheel (e.g., without a substrate) to incur strain anddeform along with portions of the wheel which may deform in response toa load. For example, a piezoelectric component may be adhered along anouter surface of a spherical tire, adhered along a spoke of an airlesstire, or adhered to any other component of a wheel that may deform inresponse to a load.

Although certain embodiments may reference piezoelectric components witha particular number of layers in a particular order, it can be notedthat piezoelectric components may include any number of layers in anyorder as desired for different applications in various embodiments. Forexample, a piezoelectric component may include four layers with atensile load backing layer connected to an upper electrode layer, whichis connected to a piezoelectric material layer, which is connected to alower electrode layer.

In various embodiments, the piezoelectric component may include apiezoelectric material that is at least one of a crystal andsemiconductor material or a polymer and organic material. Examples of acrystal and semiconductor material may include: polyvinylidene fluoride,gallium phosphate, sodium bismuth titanate, lead zirconate titanate,quartz, berlinite (AlPO4), sucrose (table sugar), rochelle salt, topaz,tourmaline-group minerals, lead titanate (PbTiO3), langasite(La3Ga5SiO14), gallium orthophosphate (GaPO4), lithium niobate (LiNbO3),lithium tantalate (LiTaO3), any of a family of ceramics with perovskite,tungsten-bronze, potassium niobate (KNbO3), sodium tungstate (Na2WO3),Ba2NaNb5O5, Pb2KNb5O15, sodium potassium niobate ((K,Na)NbO3) (e.g.,NKN, or KNN), bismuth ferrite (BiFeO3), sodium niobate (NaNbO3), bariumtitanate (BaTiO3), bismuth titanate (Bi4Ti3O12), sodium bismuth titanate(NaBi(TiO3)2), zincblende crystal, GaN, InN, AlN, and ZnO. Examples of apolymer and organic material may include: polyvinylidene fluoride (PVDF)and its copolymers, polyamides, and paralyne-C, polyimide andpolyvinylidene chloride (PVDC), and diphenylalanine peptide nanotubes(PNTs).

In various embodiments, the substrate may include at least one materialsuch as: brass, steel, spring steel sheet (SS), carbon fiber, aluminumand its alloys, titanium and its alloys, S2 fiberglass rods, glass fiberreinforced polymer laminate (Fiberite HMS/33), fiberglass, kevlarlaminate, carbon fiber reinforced materials, aramid fiber reinforcedmaterials, fiber-reinforced plastic (FRP), copper, and alloys.

In various embodiments, an energy harvester may be part of a smart wheelsensor system to provide power for least one sensor of the smart wheelsensor system. For example, the energy harvester may be arrayed on awheel of a vehicle (e.g., a wheel driven object) along with othersensors of the smart wheel sensor system. The smart wheel sensor systemmay include multiple types of sensors, which may each be configured tocollect different types of smart wheel sensor system data. For example,the smart wheel sensor system may include a height sensor configured toproduce barometric pressure sensor data; an acoustic sensor configuredto produce acoustic sensor data; an image sensor configured to produceimage sensor data; a gas sensor configured to produce gas sensor data; amagnetic sensor configured to produce magnetic sensor data; anaccelerometer sensor configured to produce acceleration sensor data; agyroscope sensor configured to produce gyroscopic sensor data; and ahumidity sensor configured to produce humidity sensor data. The smartwheel sensor system data produced by the smart wheel sensor system maybe centrally and locally analyzed at a vehicle that relies upon thesmart wheel for movement (e.g., by a computer or server within orsupported by the vehicle's body) to determine a status of the vehicleand/or an individual smart wheel. Advantageously, the smart wheel sensorsystem may be implemented in an autonomous vehicle, such as part of abackup sensor system to augment the autonomous vehicle's safety system.In various embodiments, an individual wheel on which devices of a smartwheel sensor system are arrayed may be referred to as a smart wheel.

FIG. 1 is a diagram of a smart wheel sensor system 100 that integratesat least one smart wheel 102, in accordance with various embodiments.The smart wheel sensor system 100 may include a local sensor system 104(e.g., a local smart wheel sensor system) with a device platform 106arrayed on respective smart wheels 102. The device platform 106 mayrepresent devices on a smart wheel, such as an energy harvester and/orsensor powered by an energy harvester.

This local sensor system 104 may include a local smart wheel server 108that communicates with the sensors within the device platform 106.Accordingly, each device platform 106 may include at least one sensorand also include ancillary interfaces, such as communication interfaces,for communication with the local smart wheel server 108. This localsmart wheel server 108 may also be in communication with a local smartwheel datastore 110 and any local user devices 112, such as asmartphone. For ease of explanation, the term local may refer to devicesthat are bound within or on a vehicle body 114 or a smart wheel 102 of avehicle 116.

In contrast, the term remote may refer to devices that are outside ofthe vehicle body 114 or smart wheel 102 of the vehicle 116. For example,the local smart wheel server 108 may be configured to communicate with aremote network 120, such as the Internet. This remote network 120 mayfurther connect the local smart wheel server 108 with remote servers 122in communication with remote datastores 124 or remote user devices 126.In addition, the local smart wheel server 108 may be in communicationwith external sensors or devices, such as a remote satellite 128 forglobal positioning system (GPS) information.

In various embodiments, at least some of the devices of the deviceplatform 106 may be configured to communicate with the local smart wheelserver 108 via a communications interface. This communications interfacemay enable devices to communicate with each other using anycommunication medium and protocol. Accordingly, the communicationsinterface 280 may include any suitable hardware, software, orcombination of hardware and software that is capable of coupling thedevice platform 106 with the local smart wheel server 108. Thecommunications interface may be arranged to operate with any suitabletechnique for controlling information signals using a desired set ofcommunications protocols, services or operating procedures. Thecommunications interface may comprise the appropriate physicalconnectors to connect with a corresponding communications medium. Incertain embodiments, this communications interface may be separate froma controller area network (CAN) bus. For example, the communicationsinterface may facilitate wireless communications within the local sensorsystem 104 (e.g., between the device platforms 106 and the local smartwheel server 108). Further discussion of such a communications interfaceis provided in greater detail below.

In certain embodiments, at least some of the devices of the deviceplatform 106 may be configured to communicate with the remote network120. For example, sensor data produced by a sensor of the deviceplatform 106 may be communicated to the remote servers 122, the remotedatastores 124, the remote user devices 126, and/or the remote satellite128 via the remote network 120. In various embodiments, certain devicesof the device platform 106 may communicate directly with the remotenetwork 120. For example, certain devices of the device platform 106 mayinclude communication interfaces (discussed further below) that may beconfigured to communicate directly with the remote network 120 in amanner that bypasses the local server 108. In other embodiments, certaindevices of the device platform 106 may communicate indirectly with theremote network 120. For example, certain devices of the device platform106 may include communication interfaces (discussed further below) thatmay be configured to communicate indirectly with the remote network 120via the local server 108, which includes one or more communicationinterfaces (discussed further below) to communicate with externaldevices via various communication protocols (e.g., LTE, 5G, etc.), asdiscussed in further detail below.

These communications from the device platform 106 to the remote server122, whether direct or indirect, may include sensor data collected bythe device platform for analysis by the remote server 122. This sensordata may be analyzed by the remote server 122 to determine an actionthat may be performed by the local server 108, in accordance withvarious embodiments. For example, as will be discussed in further detailbelow, this sensor data may be utilized to determine a parameter value.Then certain actions may be performed based on the state of theparameter value, such as in response to the parameter value meetingcertain threshold values (e.g., an alert or notification presented via auser interface). This determination of a parameter value may beperformed at the remote server 122 and then the parameter valuescommunicated to the local server 108 to determine the action to beperformed based on the state of the parameter value. In otherembodiments, both the determination of a parameter value and thedetermination of the resultant action may be performed by the remoteserver 122. Then the remote server 122 may communicate an indication ofthe action to be performed to the local server 108 for implementation(e.g., as an instruction to the local server 108 for implementation).Although certain embodiments describe sensor data as being communicatedto a remote server for processing, sensor data may be processed in othermanners as desired for different applications in accordance with variousembodiments. For example, the sensor data may be processed locally atthe local server 108 with or without additional inputs provided from theremote server 122, remote user device 126, and/or remote satellite 128,as will be discussed further below. In some embodiments, the deviceplatform 106 may communicate directly with the user device 112 (e.g., asmartphone) which can then communicate directly or indirectly with thelocal server 108, remote network 120, remote user device 126 and/orremote satellite 128. In further embodiments, the wheel 102 (e.g.,serving as an antenna) and/or the sensor platform 106 may have a directcommunication link with the remote user device 126 or remote satellite128 (e.g., for purposes of internet access and/or GPS applications).

FIG. 2 is a block diagram of an exemplary computing device 200, inaccordance with various embodiments. As noted above, the computingdevice 200 may represent exemplary components of a particular localsmart wheel server 108, local user device 112, remote server 122, remoteuser device 126, certain devices of a device platform 106 (e.g., asensor of the device platform), or remote satellite 128 as discussedabove in connection with FIG. 1. Returning to FIG. 2, in someembodiments, the computing device 200 includes a hardware unit 225 andsoftware 226. Software 226 can run on hardware unit 225 (e.g., theprocessing hardware unit) such that various applications or programs canbe executed on hardware unit 225 by way of software 226. In someembodiments, the functions of software 226 can be implemented directlyin the hardware unit 225 (e.g., as a system-on-a-chip, firmware,field-programmable gate array (“FPGA”), etc.). In some embodiments, thehardware unit 225 includes one or more processors, such as processor230. In some embodiments, processor 230 is an execution unit, or “core,”on a microprocessor chip. In some embodiments, processor 230 may includea processing unit, such as, without limitation, an integrated circuit(“IC”), an application specific integrated circuit (ASIC), a digitalsignal processor (DSP), an attached support processor (ASP), amicrocomputer, a programmable logic controller (“PLC”), and/or any otherprogrammable circuit. Alternatively, processor 230 may include multipleprocessing units (e.g., in a multi-core configuration). The aboveexamples are exemplary only, and, thus, are not intended to limit in anyway the definition and/or meaning of the term “processor.” Hardware unit225 also includes a system memory 232 that is coupled to processor 230via a system bus 234. Memory 232 can be a general volatile RAM. Forexample, hardware unit 225 can include a 32 bit microcomputer with 2Mbit ROM and 64 Kbit RAM, and/or a number of GB of RAM. Memory 232 canalso be a ROM, a network interface (NIC), or any combination of knownvolatile and/or non-volatile memory devices with appropriate capacitiesfor various desired applications, in accordance with variousembodiments.

In some embodiments, the system bus 234 may couple each of the varioussystem components together. It should be noted that, as used herein, theterm “couple” is not limited to a direct mechanical, communicative,and/or an electrical connection between components, but may also includean indirect mechanical, communicative, and/or electrical connectionbetween two or more components or a coupling that is operative throughintermediate elements or spaces. The system bus 234 can be any ofseveral types of bus structure(s) including a memory bus or memorycontroller, a peripheral bus or external bus, and/or a local bus usingany variety of available bus architectures including, but not limitedto, 9-bit bus, Industrial Standard Architecture (ISA), Micro-ChannelArchitecture (MSA), Extended ISA (EISA), Intelligent Drive Electronics(IDE), VESA Local Bus (VLB), Peripheral Component Interconnect CardInternational Association Bus (PCMCIA), Small Computers Interface (SCSI)or other proprietary bus, or any custom bus suitable for computingdevice applications.

In some embodiments, optionally, the computing device 200 can alsoinclude at least one media output component or display interface 236 foruse in presenting information to a user. Display interface 236 can beany component capable of conveying information to a user and mayinclude, without limitation, a display device (not shown) (e.g., aliquid crystal display (“LCD”), an organic light emitting diode (“OLED”)display, or an audio output device (e.g., a speaker or headphones). Insome embodiments, computing device 200 can provide at least one desktopinterface, such as desktop 240. Desktop 240 can be an interactive userenvironment provided by an operating system and/or applications runningwithin computing device 200, and can include at least one screen ordisplay image, such as display image 242. Desktop 240 can also acceptinput from a user in the form of device inputs, such as keyboard andmouse inputs. In some embodiments, desktop 240 can also accept simulatedinputs, such as simulated keyboard and mouse inputs. In addition to userinput and/or output, desktop 240 can send and receive device data, suchas input and/or output for a FLASH memory device local to the user, orto a local printer.

In some embodiments, the computing device 200 includes an input or auser interface 250 for receiving input from a user. User interface 250may include, for example, a keyboard, a pointing device, a mouse, astylus, a touch sensitive panel (e.g., a touch pad or a touch screen), aposition detector, and/or an audio input device. A single component,such as a touch screen, may function as both an output device of themedia output component and the input interface. In some embodiments,mobile devices, such as tablets, can be used.

In some embodiments, the computing device 200 can include a database 260as a datastore within memory 232, such that various information can bestored within database 260. Alternatively, in some embodiments, database260 can be included within a remote server (not shown) with file sharingcapabilities, such that database 260 can be accessed by computing device200 and/or remote end users. In some embodiments, a plurality ofcomputer-executable instructions can be stored in memory 232, such asone or more computer-readable storage mediums 270 (only one being shownin FIG. 2). Computer-readable storage medium 270 includes non-transitorymedia and may include volatile and nonvolatile, removable andnon-removable mediums implemented in any method or technology forstorage of information such as computer-readable instructions, datastructures, program modules or other data. The instructions may beexecuted by processor 230 to perform various functions described herein.

In the example of FIG. 2, the computing device 200 can be acommunication device, a storage device, or any device capable of runninga software component. For non-limiting examples, the computing device200 can be but is not limited to a local smart wheel server, a localuser device, a remote server, a remote user device, a device of thedevice platform, a remote satellite, a smartphone, a laptop PC, adesktop PC, a tablet, a Google™ Android™ device, an iPhone®, an iPad®,and a voice-controlled speaker or controller.

The computing device 200 has a communications interface 280, whichenables the computing device 200 to communicate with the user and otherdevices using one or more known communication mediums and communicationprotocols. Here, the communication mediums and protocols can be but arenot limited to, the Internet, an intranet, a wide area network (WAN), alocal area network (LAN), a wireless network, Bluetooth, WiFi, and amobile communication network.

In some embodiments, the communications interface 280 may include anysuitable hardware, software, or combination of hardware and softwarethat is capable of coupling the computing device 200 to one or morenetworks and/or additional devices. The communications interface 280 maybe arranged to operate with any suitable technique for controllinginformation signals using a desired set of communications protocols,services or operating procedures. The communications interface 280 maycomprise the appropriate physical connectors to connect with acorresponding communications medium, whether wired or wireless. In someembodiments, the communications interface 280 includes radio frequency(RF) communications circuitry and at least one antenna for transmittingand receiving RF signals in accordance with various known communicationprotocols (e.g., LTE, 5G, Wifi, etc.).

A communications network may be utilized as a means of communication. Invarious aspects, the network may comprise local area networks (LAN) aswell as wide area networks (WAN) including without limitation theInternet, wired channels, wireless channels, communication devicesincluding telephones, computers, wire, radio, optical or otherelectromagnetic channels, and combinations thereof, including otherdevices and/or components capable of/associated with communicating data.For example, the communication environments comprise in-bodycommunications, various devices, and various modes of communicationssuch as wireless communications, wired communications, and combinationsof the same.

Wireless communication modes comprise any mode of communication betweenpoints (e.g., communication nodes) that utilize, at least in part,wireless technology including various protocols and combinations ofprotocols associated with wireless transmission, data, and devices. Thecommunication nodes can include, for example, wireless devices such asmobile terminals, stationary terminals, base stations, access points,smartphones, and other known devices capable wireless communications viavarious wireless communication protocols. Further examples ofcommunication nodes can include wireless headsets, audio and multimediadevices and equipment, such as audio players and multimedia players,telephones, including mobile telephones and cordless telephones, andcomputers and computer-related devices and components, such as printers,network-connected machinery, and/or any other suitable device orthird-party device.

Wired communication modes comprise any mode of communication betweenpoints that utilize wired technology including various protocols andcombinations of protocols associated with wired transmission, data, anddevices. The points comprise, for example, devices such as audio andmultimedia devices and equipment, such as audio players and multimediaplayers, telephones, including mobile telephones and cordlesstelephones, and computers and computer-related devices and components,such as printers, network-connected machinery, and/or any other suitabledevice or third-party device. In various implementations, the wiredcommunication modules may communicate in accordance with a number ofwired protocols. Examples of wired protocols may comprise UniversalSerial Bus (USB) communication, RS-232, RS-422, RS-423, RS-485 serialprotocols, FireWire, Ethernet, Fibre Channel, MIDI, ATA, Serial ATA, PCIExpress, T-1 (and variants), Industry Standard Architecture (ISA)parallel communication, Small Computer System Interface (SCSI)communication, or Peripheral Component Interconnect (PCI) communication,to name only a few examples.

Accordingly, in various aspects, the communications interface 280 maycomprise one or more interfaces such as, for example, a wirelesscommunications interface, a wired communications interface, a networkinterface, a transmit interface, a receive interface, a media interface,a system interface, a component interface, a switching interface, a chipinterface, a controller, and so forth. When implemented by a wirelessdevice or within wireless system, for example, the communicationsinterface 280 may comprise a wireless interface comprising (e.g.,including) one or more antennas, transmitters, receivers, transceivers,amplifiers, filters, control logic, and so forth.

In various aspects, the communications interface 280 may provide datacommunications functionality in accordance with a number of protocols.Examples of protocols may comprise various wireless local area network(WLAN) protocols, including the Institute of Electrical and ElectronicsEngineers (IEEE) 802.xx series of protocols, such as IEEE 802.11a/b/g/n,IEEE 802.16, IEEE 802.20, and so forth. Other examples of wirelessprotocols may comprise various wireless wide area network (WWAN)protocols, such as GSM cellular radiotelephone system protocols withGPRS, CDMA cellular radiotelephone communication systems with 1×RTT,EDGE systems, EV-DO systems, EV-DV systems, HSDPA systems, 4G-LTE, 5G(new radio) and so forth. Further examples of wireless protocols maycomprise wireless personal area network (PAN) protocols, such as anInfrared protocol, a protocol from the Bluetooth Special Interest Group(SIG) series of protocols, including Bluetooth Specification versionsv1.0, v1.1, v1.2, v2.0, v2.0 with Enhanced Data Rate (EDR), as well asone or more Bluetooth Profiles, and so forth. Yet another example ofwireless protocols may comprise near-field communication techniques andprotocols, such as electro-magnetic induction (EMI) techniques. Anexample of EMI techniques may comprise passive or active radio-frequencyidentification (RFID) protocols and devices. Other suitable protocolsmay comprise Ultra Wide Band (UWB), Digital Office (DO), Digital Home,Trusted Platform Module (TPM), ZigBee, and so forth.

FIG. 3A is a perspective illustration of a smart wheel 300, inaccordance with various embodiments. The smart wheel 300 may include adevice platform 302 of at least one device. More specifically, thedevice platform 302 may include at least one device that is a sensorwithin the sensor housing 304 and at least one device that is an energyharvester 306. The device platform may be supported by (e.g., bepositioned along) a rotatable component 308 of the smart wheel 300. Therotatable component 308 may include, for example, a rim of the smartwheel 300 within which a circumference of the rotatable component 308 isbound. Although the device platform is illustrated as eight pairs ofsensor housings 304 and energy harvesters 306, any number of sensorhousings and energy harvesters may be implemented in a device platformas desired for different applications in various embodiments. Forexample, other embodiments may include multiple sensor housings for eachenergy harvester and yet further embodiments may include multiple energyharvesters for each sensor housing. Although certain embodimentsdescribe the sensor housing 304 as being located directly on a rim 308Aof the smart wheel 300 (e.g., on the rim of the rotatable component 308of the smart wheel 300), the sensor housing may also be located in otherparts of a smart wheel 300 as desired for different applications invarious embodiments. For example, the sensor housing (and theconstituent sensors) may be located closer to the center of therotatable component 308, such as along the spokes 308B of the rotatablecomponent 308 or around the center 308C (e.g., proximate a cap) of therotatable component 308 in particular embodiments.

In various embodiments, the sensor housing may represent one or moresensors together within the sensor housing along with functional modulessuch as, for example, a battery or other energy storage mediumconfigured to store energy produced by the energy harvester. In certainembodiments, the sensor housing may include a system bus (e.g., aconductive element of a printed circuit board) that connects the variousportions of the sensor housing together.

Furthermore, the sensor housing may include other functional modules,such as a communications interface to communicate the sensor datacaptured by the various sensors of the sensor housing to a local smartwheel server. This communications interface may include, for example, acommunications interface for data offload (e.g., via millimeter and/orgigahertz wavelength communications) to a local smart wheel server, toother vehicles, an infrastructure (e.g., a remote network) and/or userdevices. As a further example, this communication interface mayfacilitate wireless communications, such as via Bluetooth, radiofrequency, radio wave, ultrasonic, and/or any other type ofcommunication protocol or medium. This communication interface may beconfigured to communicate with, for example, on board electronic controlunits (ECUs) and/or advanced driver-assistance (ADAS) systems on avehicle. Additionally, the sensor housing, optionally, may include aprocessor or any other circuitry to facilitate the collection,communication, and/or analysis of sensor data produced by theconstituent sensors of the sensor housing.

Various types of sensors may be integrated with the sensor housing, inaccordance with various embodiments. For example, the sensor housing mayinclude a shock sensor that may sense an amount of electric potentialproduced by the energy harvester. The shock sensor may be configured towake up, or otherwise activate the sensors and/or functional modules ofthe sensor housing when a sufficient amount of electric potential isproduced by the energy harvester. Stated another way, the shock sensormay conceptually include the energy harvester such that the shock sensoris configured to transition various sensors and/or functional modules ofthe sensor housing from a low power or inactive state to a powered on oractive state based on the energy harvester producing more than athreshold amount of energy in response to mechanical deformation. Incertain embodiments, the energy sensed by the shock sensor may be storedin a battery for standby power when the energy harvester is notproducing any energy (e.g., when there is no mechanical stress appliedto the energy harvester).

In particular embodiments, the sensor housing may include a heightsensor configured to produce barometric pressure sensor data.Accordingly, this height sensor may be a barometric sensor or abarometric air pressure sensor that may measure atmospheric pressure,which may be indicative of an altitude or height. This barometricpressure sensor data may be utilized, for example, to determine a heightof a smart wheel from a point of reference such as a road and/orrelative to other smart wheels of a vehicle. This may allow fordetermination of roll over risk or a flat tire. As noted above, heightsensors on a smart wheel may be on a rotatable component of a wheel andthus not on a chassis of a vehicle. Thus, such height sensors may beable to provide barometric pressure sensor data on which side (e.g.,which smart wheel) initiated a roll over (e.g., when such barometricpressure sensor data is produced and recorded in a continuous or semicontinuous manner). Furthermore, road conditions, such as pot holes, canbe more accurately sensed by barometric sensor data produced by a smartwheel, in comparison to sensor data produced from a static part of achassis of a vehicle. In some embodiments, the height sensor isconfigured to also measure a deflection of an inner tire surface due tovehicle loads or a contact patch. In some embodiments, a distancemeasuring sensor can be placed into the pressurized portion of a tire.As the tire rotates, the distance of the tire relative to the centralrotating rim changes. This periodic change of distance is detectable.

In further embodiments, the sensor housing may include an acousticsensor configured to produce acoustic sensor data. Accordingly, thisacoustic sensor may be any type of acoustic, sound, or vibrationalsensor such as a geophone, a microphone, a seismometer, and a soundlocator, and the like. The acoustic sensor data may be utilized foraudio pattern recognition, such as to sense an audio signature of abrake or a rotor of a rotatable component (e.g., a wheel). This may beused for predicting a vehicle servicing schedule and/or to produceperformance optimization data. In some embodiments, the acoustic sensordata may be analyzed to identify and/or monitor for unique signaturesfor different breaking and wear out conditions, for example.

In various embodiments, the sensor housing may include an image sensorconfigured to produce image sensor data from variable attenuation ofwaves. Examples of image sensors may include are semiconductorcharge-coupled devices (CCD) or active pixel sensors in complementarymetal-oxide-semiconductor (CMOS) or N-type metal-oxide-semiconductor(NMOS) technologies. In various embodiments, a device platform thatincludes an image sensor may include a lens, or other transparent mediumon which the light waves are focused from outside of the sensor housingonto the image sensor. In particular embodiments, this image sensor mayinclude a time of flight (TOF) sensor to capture time of flight datathat may characterize a TOF. This TOF sensor may be, for example, anultrasonic TOF sensor configured to collect ultrasonic TOF sensor data.As a more specific example, an image sensor may function as a camera fordetermination of a visibility of tire tread depth for assessment of tireperformance and optimization. Such an image sensor that captures imagedata characterizing a tire tread depth may also be positioned in amanner such that image data of a tire tread may be captured (e.g., byhaving such an image sensor capture image data characterizing a treaddepth of a smart tire that the image sensor is located on, or of a tirethat the image sensor is not located on). In accordance with variousembodiments, the location of the image sensor can be either inside oroutside of the rim such that the sensor can image the sidewall of thetire. In either case, the image sensor can be electrically coupled tothe energy harvester. As another specific example, an image sensor mayinclude an infrared image sensor for authentication or identification.This infrared sensor may be utilized, for example, to scan forcharacteristics of a local environment or local object (e.g., a personapproaching a vehicle) for authentication.

In particular embodiments, the sensor housing may include a gas sensorconfigured to produce gas sensor data. This gas sensor may be any typeof sensor to monitor and characterize a gaseous atmosphere. For example,the gas sensor may utilize any of a variety of mechanisms for gasdetection, such as an electrochemical gas sensor, a catalytic bead gassensor, a photoionization gas sensor, an infrared point gas sensor, athermographic gas sensor, a semiconductor gas sensor, an ultrasonic gassensor, a holographic gas sensor, and the like. These gas sensors may,for example detect for certain types of gases, such as exhaust gases,explosive gases (e.g., for battery failure detection), atmospherichumidity, air quality, particulates, a pH level, and the like.

In particular embodiments, the sensor housing may include a magneticsensor configured to produce magnetic sensor data. This magnetic sensormaybe, for example, a magnetometer that measures magnetism fornavigation using magnetic field maps (e.g., inside a building or withina closed environment).

In additional embodiments, the sensor housing may include anaccelerometer sensor configured to produce acceleration sensor dataand/or a gyroscope sensor configured to produce gyroscopic sensor data.This acceleration sensor data and/or gyroscopic sensor data may beutilized for navigation, such as to determine an amount of accelerationfor the application of emergency brake systems. In certain embodiments,the accelerometer sensor and/or gyroscope sensor may be part of aninertial navigation system (INS) located on a smart wheel.

The energy harvester 306 may be positioned along the rotatable component308 (e.g., a rim) of the smart wheel 300 in a manner configured tocapture a kinetic energy in response to a compressive force acting on aflexible component 310 (e.g., a pneumatic or inflatable tire, tube,etc.) of the smart wheel 300 making contact with a road or object as therotatable component 308 rotates. In certain embodiments, the energyharvester 306 and/or the device platform 302 may be visible from alateral side of a vehicle or smart wheel 300 (e.g., adjacent a lateralsidewall of the vehicle or smart wheel 300). However, in otherembodiments, the energy harvester 306 and/or the device platform 302 maynot be visible from the lateral side of the vehicle or smart wheel 300.The energy harvested by the energy harvester 306 may be used to powervarious components of the device platform 302, such as various sensorsand/or communication interfaces within the sensor housing 304, asdescribed in further detail below.

In various embodiments, the energy harvester 306 may be positioned on aside wall of the rotatable component 308. For example, the energyharvester 306 may be positioned between a bead area of the flexiblecomponent 310 (e.g., a tire, tube, belt, etc.) and the rotatablecomponent 308 (e.g., a rim, shaft, etc.). Accordingly, the flexiblecomponent 310 may be mounted on the rotatable component 308. The energyharvester 306 may generate energy resulting from a compressive forceacting on the bead area of the flexible component 310 (e.g., tire, tube,etc.) as the vehicle travels over a surface (e.g., a road).

FIG. 3B is a perspective illustration of the smart wheel 300 without theflexible component, in accordance with various embodiments. Asillustrated, the energy harvester 306 may be positioned around acircumference of the rotatable component 308. Accordingly, the energyharvester 306 may generate energy resulting from a compressive force ofa moving object (e.g., a vehicle, acting on the bead area of the tiremounted on the rotatable component 308). In some embodiments, thecompressive force may be due to loading (e.g., acceleration,deceleration, etc.). As such, the location of the compressive force mayvary depending on the loading. In further embodiments, the energyharvester 306 may capture a kinetic energy of the transport moving inresponse to the rotatable component 308 rotating. Accordingly, theenergy harvester 306 may generate energy when mechanical stress isapplied to the energy harvester 306.

FIG. 4A is a perspective illustration 400A of the energy harvester 306,in accordance with various embodiments. The energy harvester 306 may bepositioned along a circumference of the rotatable component 308 (e.g.,the rim). The energy harvester 306 may include a substrate 402 that isconfigured to contact and be fixedly coupled to the rotatable component308. The substrate 402 may support a piezoelectric component 404. Thepiezoelectric component may be a transducer that converts a mechanicaldeformation into energy, in accordance with some embodiments.

The energy harvester 306 may include an electrical conduction component406 configured to channel and offload the energy produced by thepiezoelectric component 404. This electrical conduction component may beconnected with other devices of the device platform (e.g., sensors ofthe sensor housing) to provide power to the other devices of the deviceplatform. In certain embodiments, this electrical conduction component404 may be composed of a flexible conductive material such as brass orcopper. The energy harvester 306 may also include location pins 408based on which the piezoelectric component 404 may be secured to thesubstrate 402. For example, the piezoelectric component 404 may includea wingtip feature 409 with an open hole through which the location pins408 are configured to pass through in a secure manner to secure thepiezoelectric component to the substrate 402, as described in furtherdetail below.

In various embodiments, the substrate 402 may include a threedimensional curved bottom surface 410 that interfaces with the rotatablecomponent 308 (e.g., rim) of the smart wheel. This three dimensionalcurved bottom surface 410 may include a compound curve in threedimensions (e.g., length, height, and width). As noted above, each ofthe length, height, and width may define dimensions or axes orthogonalto each other in three dimensional physical space. For example, thelength may be along an axis orthogonal to the height, which may be alongan axis orthogonal to the width, which may be along an axis orthogonalto the length. In certain embodiments, the length, height, and width maybe referred to as an x-axis, a z-axis, and a y-axis, respectively. Also,the substrate 402 may include a curved staging surface 412 (e.g., amicro cavity or depression) opposite the bottom surface 410. Thisstaging surface 412 (e.g., a top surface) may also be referred to as atop surface of the substrate. In some embodiments, the curved stagingsurface 412 is curved in only two dimensions (e.g., two of a length, aheight and a width, as described in further detail below. When a forceis applied onto the piezoelectric component 404, the piezoelectriccomponent 404 will deform and conform against the two-dimensional curvedstaging surface 412, which limits the amount of deformation of thepiezoelectric component 404. Accordingly, the piezoelectric component404 can sit on the rotatable component 308 via the three dimensionalcurved bottom surface 410. Also, the rectangular piezoelectric component404 may be configured to bend within the two-dimensional curved stagingsurface 412. In certain embodiments, the two-dimensional curved stagingsurface 412 may be referred to as a convex surface. Accordingly, thetwo-dimensional curved staging surface 412 may include (e.g., be) aconvex surface to which the piezoelectric component 404, with a straight(e.g., non-curved or flat) shape or surface, may be attached. In certainembodiments, the substrate 402 may be referred to as a teardrop support.Accordingly, the piezoelectric component 404 may be bent against theconvex two-dimensional curved staging surface 412 to generatecompressive bending strain on the piezoelectric component 404. Statedanother way, the piezoelectric component 404 may incur strain such thatthe piezoelectric component 404 is bent to conform against the convextwo-dimensional curved staging surface 412 (e.g., bends against theconvex surface) to generate electrical charge (e.g., via piezoelectricmaterial layer mechanical deformation). Accordingly, the substrate 402may be structured to enable a strain (e.g., relative motion/deflection)of the piezoelectric component 404 when placed between the tire androtatable component 308 of a wheel (e.g., by the tire pushing downagainst the piezoelectric component 404).

In various embodiments, the piezoelectric component 404 may include apiezoelectric material that is at least one of a crystal andsemiconductor material or a polymer and organic material. Examples of acrystal and semiconductor material may include: polyvinylidene fluoride,gallium phosphate, sodium bismuth titanate, lead zirconate titanate,quartz, berlinite (AlPO4), sucrose (table sugar), rochelle salt, topaz,tourmaline-group minerals, lead titanate (PbTiO3), langasite(La3Ga5SiO14), gallium orthophosphate (GaPO4), lithium niobate (LiNbO3),lithium tantalate (LiTaO3), any of a family of ceramics with perovskite,tungsten-bronze, potassium niobate (KNbO3), sodium tungstate (Na2WO3),Ba2NaNb5O5, Pb2KNb5O15, sodium potassium niobate ((K,Na)NbO3) (e.g.,NKN, or KNN), bismuth ferrite (BiFeO3), sodium niobate (NaNbO3), bariumtitanate (BaTiO3), bismuth titanate (Bi4Ti3O12), sodium bismuth titanate(NaBi(TiO3)2), zincblende crystal, GaN, InN, AlN, and ZnO. Examples of apolymer and organic material may include: polyvinylidene fluoride (PVDF)and its copolymers, polyamides, and paralyne-C, polyimide andpolyvinylidene chloride (PVDC), and diphenylalanine peptide nanotubes(PNTs).

In various embodiments, the substrate 402 may include at least onematerial such as: brass, steel, spring steel sheet (SS), carbon fiber,aluminum and its alloys, titanium and its alloys, S2 fiberglass rods,glass fiber reinforced polymer laminate (Fiberite HMS/33), fiberglass,kevlar laminate, carbon fiber reinforced materials, aramid fiberreinforced materials, fiber-reinforced plastic (FRP), copper, andalloys.

FIG. 4B is a top view illustration 400B of the energy harvester 306, inaccordance with various embodiments. The top view illustration 400Billustrates how the electrical conduction component 406 may be connectedwith the piezoelectric component 404 via an interconnect 416. Statedanother way, the interconnect 416 may be a flexible structure thatconnects the piezoelectric component 404 to the electrical conductioncomponent 406 so that the electrical conduction component 406 maychannel and offload the energy produced by the piezoelectric component404. This electrical conduction component may be connected with otherdevices of the device platform to provide power to the other devices ofthe device platform.

Also, the top view illustration 400B illustrates how the substrate 402may also include location pins 408 which secure the piezoelectriccomponent 404 to the substrate 402. For example, the piezoelectriccomponent 404 may include a wingtip feature 409 with an open holethrough which the location pins 408 are configured to pass to secure thepiezoelectric component to the substrate 402. Also illustrated is thetwo-dimensional curved staging surface 412 within a cavity formed by thesubstrate 402. FIG. 4B further illustrates a cross sectional line A-Awhich will be referenced further below in connection with FIG. 5A andFIG. 5B.

FIG. 4C is a front view illustration 400C of the energy harvester 306,in accordance with various embodiments. The front view illustration 400Cillustrates how the electrical conduction component 406 may be generallybehind the substrate 402. Also, the front view illustration 400Cillustrates another view of how the substrate 402 may also includelocation pins 408 for securing the piezoelectric component 404 to thesubstrate 402. For example, the piezoelectric component 404 may includethe wingtip feature 409 with an open hole through which the locationpins 408 are configured to pass to secure the piezoelectric component tothe substrate 402. Also illustrated is the two-dimensional curvedstaging surface 412 within a cavity formed by the substrate 402.

FIG. 4D is a back view illustration 400D of the energy harvester 306, inaccordance with various embodiments. The back view illustration 400Dillustrates how the electrical conduction component 406 may be generallybehind the substrate 402 (e.g., in the foreground in the back viewillustration 400D). The back view illustration 400D also includes thethree-dimensional curved bottom surface 410 and physical interconnectionfeatures 420 on the substrate 402. This physical interconnectionfeatures 420 may be utilized to physically connect different substrates402 together, as will be discussed in further detail below. Theillustrated physical interconnection features 420 may be convex physicalinterconnection features 420 configured to interconnect with concavephysical interconnection features (not illustrated in FIG. 4D).

FIG. 4E is a bottom view illustration 400E of the energy harvester 306,in accordance with various embodiments. The bottom view illustration400E illustrates how the electrical conduction component 406 may begenerally behind the substrate 402. The bottom view illustration 400Ealso includes the three-dimensional curved bottom surface 410 andphysical interconnection features 420 on the substrate 402. As notedabove, this physical interconnection features 420 may be utilized tophysically connect different substrates 402 together, as will bediscussed in further detail below. The illustrated physicalinterconnection features 420 may be convex physical interconnectionfeatures 420 configured to interconnect with concave physicalinterconnection features (not illustrated in FIG. 4E).

FIG. 4F is a right side view illustration 400F of the energy harvester306, in accordance with various embodiments. Also, FIG. 4G illustrates aleft side view illustration 400G of the energy harvester 306, inaccordance with various embodiments. A combination of both FIG. 4F andFIG. 4G may be referred to as the side view figures. The side viewfigures illustrate the electrical conduction component 406 that may beconnected with the piezoelectric component 404 via the interconnect 416.Stated another way, the interconnect 416 may be a flexible structurethat connects the piezoelectric component 404 to the electricalconduction component 406 so that the electrical conduction component 406may channel and offload the energy produced by the piezoelectriccomponent 404. This electrical conduction component may be connectedwith other devices of the device platform to provide power to the otherdevices of the device platform. The side view figures also illustratethe three dimensional curved bottom surface 410

FIG. 5A is a side cross sectional view 500A of the energy harvester 306with the piezoelectric component 404 in an unbiased state, in accordancewith various embodiments. The side cross sectional view 500A may beacross the cross section A-A illustrated above in FIG. 4B. Returning toFIG. 5A, the side cross sectional view 500A illustrates how theelectrical conduction component 406 may be connected with thepiezoelectric component 404 via the interconnect 416. Thus, theinterconnect 416 may be a flexible structure that connects thepiezoelectric component 404 to the electrical conduction component 406so that the electrical conduction component 406 may channel and offloadthe energy produced by the piezoelectric component 404. This electricalconduction component may be connected with other devices of the deviceplatform to provide power to the other devices of the device platform.

Also, the side cross sectional view 500A illustrates how the substrate402 may also include location pins 408 based on which the piezoelectriccomponent 404 may be secured to the substrate 402. Also illustrated isthe two-dimensional curved staging surface 412 within a cavity formed bythe substrate 402. The three-dimensional curved bottom surface 410 isillustrated below and opposite the two-dimensional curved stagingsurface 412. As shown in FIG. 5A, the two-dimensional curved stagingsurface 412 is curved in two dimensions (e.g., the width and heightdimensions but not the length dimension) to form a 2-D convex surface.In contrast, the three-dimensional bottom surface 410 is curved in eachof the width, height and length dimensions. In some embodiments, the 3-Dbottom surface 410 has an S-shape cross-section, as shown in FIG. 5A.The piezoelectric component 404 in an unbiased state may be flat (e.g.,unbent) in the unbiased state as it may not experience sufficient strainto be biased.

FIG. 5B is a side cross sectional view 500B of the energy harvester 306with the piezoelectric component 404 in a biased state, in accordancewith various embodiments. The side cross sectional view 500B may beacross the cross section A-A illustrated above in FIG. 4B. Returning toFIG. 5B, the piezoelectric component 404 in a biased state mayexperience a sufficient amount of strain to bend the piezoelectriccomponent such that it conforms to the two-dimensional curved stagingsurface 412. As noted above, the piezoelectric component 404 mayalternate between the biased and unbiased states as a rotatablecomponent turns. Thus, the load from a wheel or vehicle may displace thepiezoelectric component and generate a charge (e.g., electrical energy).In some embodiments, the energy harvester can generate continuous poweras the rotatable component rotates. In certain embodiments, this energymay be in the form of an alternating current (AC) signal, which can berectified into a direct current (DC) signal. Stated another way, thebending strain experienced at the piezoelectric component may generateenergy (e.g., an alternating current (AC) voltage) with a frequencyproportional to the rotational frequency of the wheel. In someembodiments, the AC signal is rectified by a rectification circuitcontained within the sensor 304.

FIG. 6 is a perspective illustration 600 of an integrated energyharvester 606, in accordance with various embodiments. The integratedenergy harvester 606 may be positioned along a circumference of therotatable component 608 (e.g., the rim) without need for a substrate.Stated another way, the integrated energy harvester 606 may beintegrated within the rotatable component 608 and thus without aseparate physical substrate structure. The rotatable component 608 mayinclude a curved staging surface 612 formed on the rotatable component608 (e.g., a micro cavity or depression formed on the rotatablecomponent 608). In some embodiments, the curved staging surface 12 iscurved in only two dimensions (e.g., the height and width directions butnot the length direction) so as to form a two-dimensional convex surface612. The piezoelectric component 614 may incur strain to deform andconform to the two-dimensional curved staging surface 612. Also, thistwo-dimensional curved staging surface 612 may be different than therest of the rotatable component 608 which may have a three dimensionalcurved surface. The rectangular piezoelectric component 614 may beconfigured to bend within the two-dimensional curved staging surface612. In certain embodiments, the two-dimensional curved staging surface612 may be referred to as a convex surface. Accordingly, thetwo-dimensional curved staging surface 612 may include (e.g., be) aconvex surface to which the piezoelectric component 604, with a straight(e.g., non-curved or flat) shape or surface, may be more easily andsecurely attached compared to a 3-D curved surface. The piezoelectriccomponent 604 may be bent against the convex two-dimensional curvedstaging surface 612 to generate compressive bending strain on thepiezoelectric component 614. Stated another way, the piezoelectriccomponent 614 may incur strain such that the piezoelectric component isbent to conform against the convex two dimensional curved stagingsurface 612 (e.g., bends against the convex surface) to generateelectrical charge (e.g., via piezoelectric material layer mechanicaldeformation). Thus, the convex two-dimensional curved staging surface612 of the rotatable component 608 may be structured to enable a strain(e.g., relative motion/deflection) of the piezoelectric component 614when placed between the tire and rotatable component 608 of a wheel(e.g., by the tire pushing down against the piezoelectric component614).

The integrated energy harvester 606 may include an electrical conductioncomponent 616 configured to channel and offload the energy produced bythe piezoelectric component 614. This electrical conduction componentmay be connected to leads of a rechargeable battery contained within asensor housing 304 (FIGS. 3A and 3B) of the device platform to providepower to the sensor(s) within the sensor housing 304. In certainembodiments, this electrical conduction component 616 may be composed ofa flexible conductive material such as brass or copper. The integratedenergy harvester 606 may also include location pins (not illustrated) tosecure the piezoelectric component 614 to the convex two-dimensionalcurved staging surface 612 of the rotatable component 608.

In certain embodiments, the piezoelectric component may be formed withdifferent types of layers. For example, one type of layer of thepiezoelectric component may be a tensile load-backing layer. Thistensile load-backing layer may be, for example, a steel plate withsufficient tensile load flexibility to keep the piezoelectric componenttogether. Another type of layer of the piezoelectric component may be apiezoelectric material layer that may be configured to generateelectrical charge via mechanical deformation. Yet another type of layerof the piezoelectric component may be an electrode layer to harvestelectrical energy (e.g., electrical charge) from the piezoelectricmaterial layer.

FIG. 7A illustrates different layers of a piezoelectric component 700,in accordance with various embodiments. A first layer of thepiezoelectric component 700 may be a first electrode layer 702. A secondlayer of the piezoelectric component 700 may be a piezoelectric materiallayer 704. A third layer of the piezoelectric component 700 may be atensile load-backing layer 706. The fourth layer of the piezoelectriccomponent may be a second electrode layer 708.

In certain embodiments, the first electrode layer 702 may be assembledwith (e.g., be in direct physical contact when assembled with) thepiezoelectric material layer 704. The piezoelectric material layer 704may be assembled with (e.g., be in direct physical contact whenassembled with) the tensile load-backing layer 706. The tensileload-backing layer 706 may be assembled with (e.g., be in directphysical contact when assembled with) the second electrode layer 708.

In certain embodiments, this first electrode layer 702 may be closest toa two dimensional curved staging surface 412. For example, when the twodimensional curved staging surface 412/612 is on a substrate or directlyon a rotatable component, the first electrode layer 702 may directlycontact the a two dimensional curved staging surface of the substrate orthe rotatable component when the piezoelectric component (that includesthe first electrode layer 702) is biased. Also, the second electrodelayer 708 may be (among the different layers) the furthest from the twodimensional curved staging surface.

Each electrode layer (e.g., the first electrode layer 702 and the secondelectrode layer 708) may include an electrode 710 embedded within (e.g.,held in place by) a flexible material (e.g., an epoxy). In certainembodiments, such as illustrated with the first electrode layer 702, theelectrode 710 may be formed as a mesh that may directly contact thepiezoelectric material layer to harvest electrical charge from thepiezoelectric material layer 704. In other embodiments, such asillustrated with the second electrode layer 708, the electrode 710 maybe formed as a mesh that may indirectly contact (e.g., via the tensileload backing layer 706) the piezoelectric material layer to harvestelectrical charge from the piezoelectric material layer 704.Accordingly, the first electrode layer 702 and the second electrodelayer 708 may represent different circuits with different electricpotentials, such that there is an electric potential difference betweenthe first electrode layer 702 and the second electrode layer 708.

Each electrode layer may interface with a flexible interconnect 712connected with their respective electrode 710. This flexibleinterconnect 712 may be configured for interconnection of the electrode710 in the electrode layer 702 to other electrical components, such asto provide power to devices of a smart wheel sensor system or for thedevices of the smart wheel sensor system to perform measurements off ofthe flexible interconnect (e.g., measurements of energy or electricpotential).

In particular embodiments, the tensile load backing layer 706 may bemade of stainless steel. The tensile load backing layer may provideadditional physical support to hold the piezoelectric component in aflat state when unbiased. For example, the tensile load backing layermay be flat or unbent in a resting or unbiased position such that aftertension is released from the piezoelectric component, the tensile loadbacking layer may unbias or physically reorient the piezoelectriccomponent into an unbiased state (e.g., a flat state).

In various embodiments, the piezoelectric material layer 704 may be madeof a piezoelectric material. This piezoelectric material may be, forexample, at least one of a crystal and semiconductor material or apolymer and organic material. Examples of a crystal and semiconductormaterial may include: polyvinylidene fluoride, gallium phosphate, sodiumbismuth titanate, lead zirconate titanate, quartz, berlinite (AlPO4),sucrose (table sugar), rochelle salt, topaz, tourmaline-group minerals,lead titanate (PbTiO3), langasite (La3Ga5SiO14), gallium orthophosphate(GaPO4), lithium niobate (LiNbO3), lithium tantalate (LiTaO3), any of afamily of ceramics with perovskite, tungsten-bronze, potassium niobate(KNbO3), sodium tungstate (Na2WO3), Ba2NaNb5O5, Pb2KNb5O15, sodiumpotassium niobate ((K,Na)NbO3) (e.g., NKN, or KNN), bismuth ferrite(BiFeO3), sodium niobate (NaNbO3), barium titanate (BaTiO3), bismuthtitanate (Bi4Ti3O12), sodium bismuth titanate (NaBi(TiO3)2), zincblendecrystal, GaN, InN, and ZnO. Examples of a polymer and organic materialmay include: polyvinylidene fluoride (PVDF) and its copolymers,polyamides, and paralyne-C, polyimide and polyvinylidene chloride(PVDC), and diphenylalanine peptide nanotubes (PNTs).

In various embodiments, the electrode layers may be electrically bondedto other layers of the piezoelectric component (e.g., to the tensileload backing layer and/or the piezoelectric material layer). Also, thetensile load backing layer may be electrically and/or mechanicallybonded to the piezoelectric material layer. The assembly of all thelayers of a piezoelectric component may form the piezoelectric component(which may be referred to as a piezoelectric electrode assembly incertain embodiments). In further embodiments, the piezoelectriccomponent may be encapsulated in a protective coating, such as a heatshrinkable film or a polymer to protect the piezoelectric component fromenvironmental degradation.

FIG. 7B illustrates the piezoelectric component 700 in an assembledform, in accordance with various embodiments. When in an assembled form,the first electrode layer may be in direct physical contact with thepiezoelectric material layer. The piezoelectric material layer may be indirect physical contact with the tensile load-backing layer. Lastly, thetensile load backing layer may be in direct physical contact with thesecond electrode layer.

FIG. 8A is a perspective illustration of the energy harvester 802 with apiezoelectric component 804 secured at one end to a substrate 806, inaccordance with various embodiments. The piezoelectric component 804 isillustrated with a visible mesh formation. As noted above, the energyharvester 802 may be positioned along a circumference of a rotatablecomponent (e.g., the rim of a wheel). The energy harvester 802 mayinclude the substrate 806 that contacts the rotatable component. Thesubstrate 806 may support the piezoelectric component 804 by securingthe piezoelectric component 804 to the substrate 806 at a first end 808of the piezoelectric component 804. Stated another way, the substrate806 may clamp down and secure a piezoelectric component 804 at a firstend 808 of the piezoelectric component 804.

The energy harvester 802 may include electrical conduction componentopenings 812 configured to receive an electrical conduction component(not illustrated), such as pins, configured to channel and offload theenergy produced by the piezoelectric component 804. This electricalconduction component may be connected with other devices of the deviceplatform to provide power to the other devices of the device platform.In certain embodiments, this electrical conduction component may becomposed of a conductive material such as brass or copper.

In various embodiments, the substrate 806 may include athree-dimensional curved bottom surface 820 that interfaces with therotatable component (e.g., rim) of a wheel. This three-dimensionalcurved bottom surface 820 may include a compound curve in threedimensions (e.g., length, height, and width) so that the substrate 806may rest flush with a three dimensional curved surface of the rotatablecomponent. As noted above, each of the length, height, and width maydefine dimensions or axes orthogonal to each other in three-dimensionalphysical space. For example, the length may be along an axis orthogonalto the height, which may be along an axis orthogonal to the width, whichmay be along an axis orthogonal to the length. In certain embodiments,the length, height, and width may be referred to as an x-axis, a z-axis,and a y-axis. Also, the substrate 806 may include a curved stagingsurface 822 (e.g., a micro cavity or depression in the substrate 806)opposite the bottom surface 820. In some embodiments, the curved stagingsurface 822 is curved in only two dimensions (e.g., the height and widthdimensions). The piezoelectric component 804 may incur strain to deformand conform to the two-dimensional curved staging surface 822. Asdiscussed above, the piezoelectric component 804 can sit on therotatable component via the three-dimensional curved bottom surface 820of the substrate 806. Also, the rectangular piezoelectric component 804may be configured to bend and conform to the two-dimensional curvedstaging surface 822. In certain embodiments, the two-dimensional curvedstaging surface 822 may be referred to as a convex surface. Accordingly,the two-dimensional curved staging surface 822 may include (e.g., be) aconvex surface to which the piezoelectric component 804, with a straight(e.g., non-curved or flat) shape or surface, may be attached. In certainembodiments, the substrate 806 may be referred to as a teardrop support.Accordingly, the piezoelectric component 804 may be bent against theconvex two-dimensional curved staging surface 822 to generatecompressive bending strain on the piezoelectric component 804. Statedanother way, the piezoelectric component 804 may incur strain such thatthe piezoelectric component bends due to external forces to conform tothe convex two-dimensional curved staging surface 822 to generateelectrical charge (e.g., via piezoelectric material layer mechanicaldeformation). Accordingly, the substrate 806 may be structured to enablea strain (e.g., relative motion/deflection) of the piezoelectriccomponent 804 when placed between the tire and rotatable component of awheel (e.g., by the tire pushing down against the piezoelectriccomponent 804).

FIG. 8B is a perspective illustration of the substrate 806 without thepiezoelectric component, in accordance with various embodiments. Asnoted above, the substrate may include electrical conduction componentopenings or slots 812 configured to receive an electrical conductioncomponent (not illustrated), such as pins, configured to channel andoffload the energy produced by the piezoelectric component 804. Also, invarious embodiments, the substrate 806 may include a three-dimensionalcurved bottom surface 820 that interfaces with the rotatable component(e.g., rim) of a smart wheel, as described above.

As introduced above, a piezoelectric component may include a lowerelectrode layer that may be formed as a mesh to harvest electricalcharge from a piezoelectric material layer. The mesh formation (e.g.,the physical structure of the mesh) of an electrode layer may be in anyconfiguration or structure. In particular embodiments, the meshformation of the electrode layer may be as a single elongated electrodethat traverses a two dimensional space (e.g., along a surface of a layerof the piezoelectric component). Accordingly, the electrode layer may bea layer of the piezoelectric component that includes an electrodegenerally held in place by a flexible material (e.g., an epoxy). Inparticular embodiments, an electrode layer (e.g., an upper electrodelayer and/or lower electrode layer) may be monolithic (e.g., be a solidlayer of electrode coextensive with a surface of another layer of thepiezoelectric component). In further embodiments, the lower electrodelayer may include a different mesh formation than the upper electrodelayer. In yet further embodiments, the lower electrode layer may includea same mesh formation as the upper electrode layer. FIGS. 9A-9Qillustrate a number of different exemplary mesh formations, inaccordance with various embodiments.

FIG. 9A illustrates an exemplary mesh formation of an electrode as astraight winding, in accordance with various embodiments. This straightwinding mesh formation 900A may represent a single elongated electrodethat traverses a two dimensional space (e.g., along a surface of a layerof the piezoelectric component 902A).

FIG. 9B illustrates an exemplary mesh formation of an electrode as acurved winding, in accordance with various embodiments. This curvedwinding mesh formation 900B may represent a single elongated electrodethat winds in a curved manner (e.g., more curved than the abovereferenced straight winding) along a two dimensional space (e.g., alonga surface of another layer of the piezoelectric component 902B).

FIG. 9C illustrates an exemplary mesh formation of an electrode as azig-zag winding, in accordance with various embodiments. This zig-zagwinding mesh foil cation 900C may represent a single elongated electrodethat winds in a zig-zag manner along a two dimensional space (e.g.,along a surface of another layer of the piezoelectric component 902B).

FIG. 9D illustrates an exemplary mesh formation of an electrode as a onesided bowled winding, in accordance with various embodiments. This onesided bowled winding mesh formation 900D may represent a singleelongated electrode that winds in a one sided bowled manner along a twodimensional space (e.g., along a surface of another layer of thepiezoelectric component 902D). The one sided bowled manner may refer tointermediate bowl or half circular formations 904D that bowl out towardone direction.

FIG. 9E illustrates an exemplary mesh formation of an electrode as a twosided bowled winding, in accordance with various embodiments. This twosided bowled winding mesh formation 900E may represent a singleelongated electrode that winds in a two sided bowled manner along a twodimensional space (e.g., along a surface of another layer of thepiezoelectric component 902E). The two sided bowled manner may refer tointermediate bowl or half circular formations 904E that bowl out towardtwo directions.

FIG. 9F illustrates an exemplary mesh formation of an electrode as asharp winding, in accordance with various embodiments. This sharpwinding mesh formation 900F may represent a single elongated electrodethat winds in a sharp manner (e.g., at an acute angle of around 90degrees) along a two dimensional space (e.g., along a surface of anotherlayer of the piezoelectric component 902F).

FIG. 9G illustrates an exemplary mesh formation of an electrode as apartial curved winding, in accordance with various embodiments. Thispartial curved winding mesh formation 900G may represent a singleelongated electrode that winds in a curved manner (e.g., more curvedthan the above referenced straight winding) partially along a twodimensional space (e.g., along a surface of another layer of thepiezoelectric component 902G).

FIG. 9H illustrates an exemplary mesh formation of an electrode as adeep curved winding, in accordance with various embodiments. This deepcurved winding mesh formation 900H may represent a single elongatedelectrode that winds in a deeply curved manner (e.g., more curved thanthe above referenced curved winding) along a two dimensional space(e.g., along a surface of another layer of the piezoelectric component902H).

FIG. 9I illustrates an exemplary mesh formation of an electrode as agrid, in accordance with various embodiments. This grid mesh formation900I may represent an elongated electrode in a grid formation along atwo dimensional space (e.g., along a surface of another layer of thepiezoelectric component 902I).

FIG. 9J illustrates an exemplary mesh formation of an electrode as abackslash grid, in accordance with various embodiments. This backslashgrid mesh formation 900J may represent an elongated electrode in abackslash grid formation along a two dimensional space (e.g., along asurface of another layer of the piezoelectric component 902J).

FIG. 9K illustrates an exemplary mesh formation of an electrode as aforward slash grid, in accordance with various embodiments. This forwardslash grid mesh formation 900K may represent an elongated electrode in aforward slash grid formation along a two dimensional space (e.g., alonga surface of another layer of the piezoelectric component 902K).

FIG. 9L illustrates an exemplary mesh formation of an electrode as aback and forward slash grid, in accordance with various embodiments.This back and forward slash grid mesh formation 900L may represent anelongated electrode in a back and forward slash grid formation along atwo dimensional space (e.g., along a surface of another layer of thepiezoelectric component 902L).

FIG. 9M illustrates an exemplary mesh formation of an electrode as alooping winding, in accordance with various embodiments. This loopingwinding mesh formation 900M may represent a single elongated electrodethat winds in a looping manner along a two dimensional space (e.g.,along a surface of another layer of the piezoelectric component 902M).

FIG. 9N illustrates an exemplary mesh formation of an electrode as apointed winding, in accordance with various embodiments. This pointedwinding mesh formation 900N may represent a single elongated electrodethat winds in a pointed manner (e.g., with points or acute angles facingone direction) along a two dimensional space (e.g., along a surface ofanother layer of the piezoelectric component 902N).

FIG. 9O illustrates an exemplary mesh formation of an electrode as acomplex looped winding, in accordance with various embodiments. Thiscomplex looped winding mesh formation 900O may represent a singleelongated electrode that winds in a complex looped manner (e.g., withloops more complex than the looping manner referenced above) along a twodimensional space (e.g., along a surface of another layer of thepiezoelectric component 902O).

FIG. 9P illustrates an exemplary mesh formation of an electrode as a twosided segmented bowled winding, in accordance with various embodiments.This two sided segmented bowled winding mesh formation 900P mayrepresent a single elongated electrode that winds in a two sidedsegmented bowled manner along a two dimensional space (e.g., along asurface of another layer of the piezoelectric component 902P). The twosided segmented bowled manner may refer to bowled winding that is formedof straight segments 904P that bowl out toward two directions.

FIG. 9Q illustrates an exemplary mesh formation of an electrode as amonolith, in accordance with various embodiments. This monolithic meshformation 900Q may represent an electrode formed as a monolith (e.g., asa plate) along a two dimensional space (e.g., along a surface of anotherlayer of the piezoelectric component 902Q).

The various mesh formations shown in FIGS. 9A-9Q, as discussed above,are exemplary and not intended to limit the mesh formations that may beutilized in various embodiments of the invention. The different meshformations provide/allow various strain relief/fatigue failure tolerancebased on the geometry and configuration of the piezoelectric material.The strain induced, and thus the energy generated on the piezo will beaffected by the mesh formation and can be optimized using one or moreembodiments of the aforementioned configurations.

FIG. 10A illustrates a ring formation of energy harvesters with anactive/passive bank feature, in accordance with various embodiments. Thering formation of energy harvesters 1000 may form a concentric loop thatmatches a circumference of a rotatable component (not shown) to which itmay be coupled. In certain embodiments, this ring formation of energyharvesters 1000 may form an active/passive bank feature where the energyharvesters 1002 (e.g., active banks) are connected via a bridge 1004(e.g., a passive bank). In certain embodiments, the bridge 1004 orpassive bank may be a substrate without a piezoelectric component. Inother embodiments, the bridge 1004 or passive bank may include an energystorage medium, such as a rechargeable battery in electricalcommunication with an electrical conduction component of the energyharvesters 1002.

FIG. 10B illustrates a ring formation 1010 of energy harvesters 1012with an interlocking feature, in accordance with various embodiments.The ring formation 1010 of energy harvesters 1012 may form a concentricloop that matches a circumference of a rotatable component (not shown)to which it may be coupled. In certain embodiments, this ring formation1010 of energy harvesters 1012 may be formed of energy harvesters 1012that include an interlocking feature that interlocks or connectsdifferent energy harvesters 1012 together, as described in furtherdetail below.

FIG. 10C illustrates disconnected energy harvesters of the ringformation of energy harvesters with an interlocking feature, inaccordance with various embodiments. These energy harvesters 1012 mayinclude an interlocking feature that interlocks or connects differentenergy harvesters 1012 together. This interlocking features may include,for example, physical interconnection features 1014A, 1014B on asubstrate 1016 of the energy harvester 1012. The physicalinterconnection features 1014A, 1014B may be utilized to physicallyconnect different energy harvesters 1012 together via their substrates1016. For example, different substrates 1016 may have either afemale-type (e.g., concave) physical interconnection feature 1014A or amale-type (e.g., convex) physical interconnection feature 1014B. Theconvex physical interconnection feature 1014B may be configured to mateand interconnect with the concave physical interconnection feature1014A.

Also illustrated in FIG. 10C is a curved staging surface 1018 (e.g., astaging surface within a micro cavity or depression) of the substrate1016. In some embodiments, the curved staging surface 1018 is curved inonly two dimensions (e.g., the height and width dimensions). As notedabove, a piezoelectric component may incur strain to deform and conformto the two dimensional curved staging surface 1018. Accordingly, therectangular piezoelectric component may be configured to bend within andtoward the two-dimensional curved staging surface 1018. In certainembodiments, the two-dimensional curved staging surface 412 may be aconvex surface.

FIG. 10D illustrates connected energy harvesters of the ring formationof energy harvesters with an interlocking feature, in accordance withvarious embodiments. As illustrated in FIG. 10D, the convex physicalinterconnection feature 1014B of one substrate 1016 may beinterconnected with the concave physical interconnection feature 1014Aof another substrate 1016 to form connected energy harvesters.

FIG. 10E illustrates connected energy harvesters of a continuous ringformation, in accordance with various embodiments. The continuous ringformation 1050 may form a concentric loop with a circumference of arotatable component. In certain embodiments, this continuous ringformation 1050 may include energy harvesters 1052 that include only apiezoelectric component without a separate substrate. For example, thecontinuous ring formation 1050 may include respective energy harvesters1052 at regions of the continuous ring formation 1050 withtwo-dimensional (e.g., two of a length, a height and a width) curvedstaging surfaces (e.g., a micro cavity or depression in the surface ofthe ring 1050) in which a piezoelectric component is located. As notedabove, the piezoelectric component may incur strain to deform andconform to the two dimensional curved staging surface.

FIG. 11A illustrates a plan cross sectional view 1100 of an energyharvester energy connector 1102 that runs within a tire 1104, inaccordance with various embodiments. The energy harvester energyconnector 1102 may be a wire or other conductive element that connectsthe interconnects of different energy harvesters 1106 together.Accordingly, the energy harvester energy connector 1102 may aggregatethe collected energy of the various energy harvesters 1106 togetheralong the energy harvester energy connector 1102. As illustrated, theenergy harvester energy connector 1102 may run within the tire 1104(e.g., within a pressurized region of a tire 1104) as it traversesbetween energy harvesters 1106 that are positioned on a rotatablecomponent 1108.

FIG. 11B illustrates a plan cross sectional view 1150 of an energyharvester energy connector 1152 that runs within a rotatable component1153, in accordance with various embodiments. As noted above, oneexample of the rotatable component 1153 is a rim. The energy harvesterenergy connector 1152 may be a wire or other conductive element thatconnects the interconnects of different energy harvesters 1156(represented as dots) together. Accordingly, the energy harvester energyconnector 1152 may aggregate the collected energy of the various energyharvesters 1156 together along the energy harvester energy connector1152. As illustrated, the energy harvester energy connector 1152 may runwithin the rotatable component 1153 (e.g., not within a pressurizedregion of a tire 1154) as it traverses between energy harvesters 1156that are positioned on the rotatable component 1158.

FIG. 12A illustrates an energy harvester 1202 disposed on a spoke 1204of an airless tire 1206, in accordance with various embodiments. Theairless tire 1206 may be a non-pneumatic tire (NPT), or flat-free tirethat is not supported by air pressure. The airless tire 1206 may includespokes 1204 that radiate from a rotatable component 1208. These spokes1204 may bend as the airless tire 1206 incurs a load and/or rotates(e.g., rotates under a load).

In various embodiments, an energy harvester 1202 may only include apiezoelectric component without a substrate. For example, such energyharvesters 1202 may refer to a piezoelectric component placed on a partof the airless tire 1206 with a two-dimensional (e.g., two of a length,a height and a width) curved staging surface that is part of a spoke1204 of the airless tire 1206.

FIG. 12B illustrates an energy harvester 1212 disposed on a joint 1214of the spoke 1204 of an airless tire 1206, in accordance with variousembodiments. As noted above, the airless tire 1206 may include spokes1204 that radiate from a rotatable component 1208. These spokes 1204 maybend as the airless tire 1206 incurs a load and/or rotates (e.g.,rotates under a load). Also, these spokes 1204 may include a joint 1214,which may be a part of the spoke 1204 that is bent in a resting position(e.g., when not biased) and thus may be prone to greater bending whenbiased compared to the remaining portions of the spoke 1204.

In various embodiments, the energy harvesters 1212 may only include apiezoelectric component without a substrate. For example, such energyharvesters 1212 may refer to a piezoelectric component placed on a partof the airless tire 1206 with a two-dimensionally curved staging surfacethat is part of a joint 1214 of the spoke 1204 of the airless tire 1206.

FIG. 12C illustrates an energy harvester 1222 disposed around a terminusregion 1224 of the spoke 1204 of the airless tire 1206, in accordancewith various embodiments. As noted above, the airless tire 1206 mayinclude spokes 1204 that radiate from a rotatable component 1208. Thesespokes 1204 may bend as the airless tire 1206 incurs a load and/orrotates (e.g., rotates under a load). Also, these spokes 1204 mayinclude a terminus region 1224, which may be around a part of the spoke1204 that terminates (e.g., terminates at the rotatable component 1208or terminates at an outer circumference 1226). This terminus region 1224may incur strain when the airless tire 1206 incurs a load and/or rotates(e.g., rotates under a load).

In various embodiments, the energy harvesters 1222 may include apiezoelectric component placed on a two-dimensional (e.g., two of alength, a height and a width) curved staging surface (e.g., a microcavity or depression). This two-dimensional curved staging surface maybe provided by a cavity into which the piezoelectric component may bendwhen strain is incurred (e.g., when biased). This two-dimensional curvedstaging surface may be proximate to the terminus and may be eitherdirectly formed as part of the airless tire 1206 or be on a substrate inorder to facilitate the application of strain onto the piezoelectriccomponent.

FIG. 13A illustrates an energy harvester 1302 disposed on a sphericalwheel, in accordance with various embodiments. The spherical wheel maybe a wheel that is formed as a sphere. In various embodiments, energyharvesters 1302 may be disposed along a spherical wheel outer surface1304 (a surface of the spherical wheel that contacts, or that isproximate to, a point of contact with an underlying surface (e.g.,ground) that the spherical wheel may rotate or roll against). In FIG.13A, a view of the energy harvestor 1302 on the spherical surface 1304is magnified for purposes of illustration. This spherical wheel outersurface 1304 may incur a load at a point at which the outer surfacecontacts an underlying surface (e.g., ground).

In various embodiments, the energy harvesters 1302 may include apiezoelectric component 1306 placed on a two-dimensional (e.g., two of alength, a height and a width) curved staging surface (e.g., a microcavity or depression that the piezoelectric component 1306 may deforminto). Accordingly, this two-dimensional curved staging surface may bepart of a cavity into which the piezoelectric component 1306 may bendwhen strain is incurred (e.g., when biased). This two-dimensional curvedstaging surface may be along the spherical wheel outer surface 1304 andmay be either directly formed as part of the spherical wheel outersurface 1304 or be on a substrate connected (e.g., adhered) to orotherwise proximate the spherical wheel outer surface 1304 in order tofacilitate the application of strain onto the piezoelectric component1306.

FIG. 13B illustrates energy harvesters 1352 disposed on a sphericalwheel in a band formation, in accordance with various embodiments. Thespherical wheel may be a wheel that is formed as a sphere. In variousembodiments, energy harvesters 1352 may be disposed along a sphericalwheel outer surface 1354 (a surface of the spherical wheel thatcontacts, or that is proximate to, a point of contact with an underlyingsurface (e.g., ground) that the spherical wheel may rotate or rollagainst). This spherical wheel outer surface 1354 may incur a load at apoint at which the outer surface contacts an underlying surface.

In various embodiments, the energy harvesters 1352 may include apiezoelectric component placed with a two-dimensional (e.g., two of alength, a height and a width) curved staging surface (e.g., with a microcavity or depression that the piezoelectric component 1306 may deforminto). This two-dimensional curved staging surface may form a cavityinto which the piezoelectric component may bend when strain is incurred(e.g., when biased). Accordingly, this two-dimensional curved stagingsurface may be along the spherical wheel outer surface 1354 and may beeither directly formed as part of the spherical wheel outer surface 1354or be on a substrate connected (e.g., adhered) to or otherwise proximatethe spherical wheel outer surface 1304 in order to facilitate theapplication of strain onto the piezoelectric component.

In certain embodiments, the energy harvesters 1352 may be formed withband formations 1356 where different energy harvesters within a bandformation (e.g., around relative concentric circumferences) are relatedbut different energy harvesters outside of a band formation are not. Thelines representing the band formations may not be physically noticeableon the spherical wheel outer surface 1354 but are illustrated in FIG.13B for ease of explanation. By being related, the energy harvesterswithin a band formation may be related in that they are of a same shape,a same size, a same distance from each other, or have any other physicalsimilarity to each other. Also, in further embodiments, energyharvesters 1352 within a band formation 1356 may be electrically coupledtogether, such as by being electrically coupled together via an energyharvester energy connector. In various embodiments, a collection ofthese energy harvesters 1352 in band formations 1356 may cover an entirespherical wheel outer surface 1354. In certain embodiments, differentband formations 1356 may have different sizes (e.g., circumferences)such that they also constitute a different number of energy harvesters.In particular embodiments, a band formation 1356 may have only a singleenergy harvester but may still be referred to as a band formation tocontrast with other band formations 1356 along the spherical wheel outersurface 1354.

FIG. 14 is a flow chart of an energy harvester process 1400, inaccordance with various embodiments. The process 1400 may be performedat a smart wheel sensor system that integrates an energy harvester andat least one device configured to be powered by the energy harvester, asintroduced above. It is noted that the process 1400 is merely anexample, and is not intended to limit the present disclosure.Accordingly, it is understood that additional operations (e.g., blocks)may be provided before, during, and after the process 1400 of FIG. 14,certain operations may be omitted, certain operations may be performedconcurrently with other operations, and that some other operations mayonly be briefly described herein.

At block 1402, a wheel may be moved (e.g., rotated) under a load (e.g.,a load of the wheel itself or a wheel driven object (e.g., a vehicle)).As noted above, this wheel may be a smart wheel or a smart wheel sensorsystem that integrates an energy harvester and at least one deviceconfigured to be powered by the energy harvester. The energy harvesterincludes a piezoelectric component placed on a curved staging surface.This curved staging surface may be part of a cavity into which thepiezoelectric component may bend when strain is incurred (e.g., whenbiased). This curved staging surface may be either directly formed aspart of the wheel or on a substrate mounted on part of the wheel inorder to facilitate the application of strain onto the piezoelectriccomponent.

Furthermore, this energy harvester may include a piezoelectric componentthat includes a piezoelectric material layer and at least one electrodelayer. Also, the piezoelectric component may be connected with aninterconnect and an electrical conduction component. This piezoelectricmaterial layer may produce energy when mechanically deformed. Theelectrode layer may capture the energy produced by the piezoelectricmaterial layer. The electrode layer may be connected via theinterconnect to the electrical conduction component. The interconnectmay be a flexible structure that connects the piezoelectric component tothe electrical conduction component so that the electrical conductioncomponent may channel and offload the energy produced by thepiezoelectric component. This electrical conduction component may beconnected with other devices of a device platform (e.g., an energystorage medium or a sensor of the smart wheel sensor system) to providepower to the other devices of the device platform.

At block 1404, the piezoelectric component of the energy harvester maydeform (e.g., mechanically deform) to generate energy resulting fromcompressive force due to wheel rotation (e.g., a vehicle, acting on thebead area of the tire mounted on the rotatable component). Statedanother way, the piezoelectric component may capture a kinetic energy ofa transport moving in response to the rotatable component rotating.Accordingly, the piezoelectric component may generate energy whenmechanical stress is applied to the piezoelectric component. Forexample, this energy may be in the form of an alternating current (AC)signal, which can be rectified into a direct current (DC) signal. Statedanother way, the bending strain experienced at the piezoelectriccomponent may generate energy (e.g., an AC voltage) with a frequencyproportional to the rotational frequency of the wheel.

At block 1406, the energy generated by the energy harvester may betransferred to a device of the smart wheel sensor system. As notedabove, this energy may be transferred by, for example, the electricalconduction component to the device. The electrical conduction componentmay be any type of conductor configured to transfer the energy producedby the energy harvester, such as a wire, a ribbon, or a pin made of aconductive material to transfer the energy from the energy harvester tothe device.

At block 1408, the device connected with the electrical conductioncomponent may be powered by the energy generated by the energyharvester. This device may be, for example, an energy storage medium ora sensor of the smart wheel sensor system. Accordingly, the energyharvester may be part of a smart wheel sensor system to provide powerfor least one energy storage medium or sensor of the smart wheel sensorsystem. The smart wheel sensor system may include multiple types ofsensors, which may each be configured to collect different types ofsmart wheel sensor system data. For example, the smart wheel sensorsystem may include a height sensor configured to produce barometricpressure sensor data and/or deflection of an inner surface of a tire, asdiscussed above; an acoustic sensor configured to produce acousticsensor data; an image sensor configured to produce image sensor data; agas sensor configured to produce gas sensor data; a magnetic sensorconfigured to produce magnetic sensor data; an accelerometer sensorconfigured to produce acceleration sensor data; a gyroscope sensorconfigured to produce gyroscopic sensor data; and a humidity sensorconfigured to produce humidity sensor data.

As noted above, in various embodiments the device powered by an energyharvester may be smart wheel sensor of a smart wheel sensor system. FIG.15 is a flow chart of a smart wheel process 1500, in accordance withvarious embodiments. The process 1500 may be performed at a smart wheelsensor system that includes a device powered by the energy harvester andin communication with a local smart wheel server, as introduced above.It is noted that the process 1500 is merely an example, and is notintended to limit the present disclosure. Accordingly, it is understoodthat additional operations (e.g., blocks) may be provided before,during, and after the process 1500 of FIG. 15, certain operations may beomitted, certain operations may be performed concurrently with otheroperations, and that some other operations may only be briefly describedherein.

At block 1502, smart wheel sensor system data may be collected locallyfrom various devices that are sensors powered by at least one energyharvester. As discussed above, a smart wheel may be a wheel of a vehiclewith a local network connected sensor system of at least one device thatis a sensor arrayed on the wheel itself. The smart wheel sensor systemmay include multiple types of sensors, which may each be configured tocollect different types of smart wheel sensor system data. For example,the smart wheel sensor system may include a height sensor configured toproduce barometric pressure sensor data; an acoustic sensor configuredto produce acoustic sensor data; an image sensor configured to produceimage sensor data; a gas sensor configured to produce gas sensor data; amagnetic sensor configured to produce magnetic sensor data; anaccelerometer sensor configured to produce acceleration sensor data; agyroscope sensor configured to produce gyroscopic sensor data; and ahumidity sensor configured to produce humidity sensor data. In certainembodiments, these sensors may be woken up by a shock sensor that maysense an amount of energy produced by an energy harvester also on thesmart wheel.

At block 1504, the smart wheel sensor system data may be communicatedlocally to a local smart wheel server from the device platforms arrayedon a smart wheel. This communication may be made via a communicationsinterface. This communications interface may enable devices tocommunicate with each other over various communication mediums usingknown communication protocols, in accordance with various embodiments.For example, in some embodiments, the communications interface mayprovide communications using one or more communication networksfollowing certain communication protocols, such as TCP/IP, http, https,ftp, and sftp protocols. Accordingly, the communications interface mayinclude any suitable hardware, software, or combination of hardware andsoftware that is capable of coupling the respective device platformswith the local smart wheel server. The communications interface may bearranged to operate with any suitable technique for controllinginformation signals using a desired set of communications protocols,services or operating procedures. In certain embodiments, thiscommunications interface may be separate from a controller area network(CAN) bus, and thus have lower latency than communications across theCAN bus.

At block 1506, the smart wheel sensor system data may be analyzed orprocessed to determine a parameter value. This parameter value maycharacterize any type of real world parameter, such as an elevation, asound pattern or sound level, an image pattern in an image or video, theamount of a type of gas, an orientation around a magnetic object, anamount of accelerator, an amount of angular velocity, a humidity level,and the like.

In certain embodiments, this parameter value may characterize acombination of different types of local smart wheel sensor system dataand/or a combination of local smart wheel sensor system data with otherdata accessible to the local smart wheel server. For example, thisparameter value may characterize a combination of one or more of:barometric pressure sensor data; acoustic sensor data; image sensordata; gas sensor data; magnetic sensor data; acceleration sensor data;gyroscopic sensor data; humidity sensor data, and the like. As anotherexample, this parameter value may characterize a combination of localsmart wheel sensor system data with other data, whether predetermined(e.g., vehicle build and other specifications) or received from outsideof local smart wheel sensor system data (e.g., remote data, such as GPSdata received from a satellite or data received from a remote serverover a remote network).

For example, the smart wheel sensor system data may include barometricpressure sensor data that may be utilized to determine an elevationparameter value. This elevation parameter value may characterize anelevation of a smart wheel with respect to a reference point (e.g., aground elevation) and/or relative to other smart wheels of a particularvehicle. As another example, the smart wheel sensor system data mayinclude acoustic sensor data (e.g., sound) that may be utilized todetermine an audio parameter value. This audio parameter value maycharacterize a sound detectible at the rotatable component. As anotherexample, the parameter value may take into consideration (e.g., reflect)any of a variety of inputs, such as mileage, wheel dynamics, tirepressure, load conditions, road conditions, balancing information,height conditions, ambient sounds, brake dynamics, and the like.

In various embodiments, a parameter value may represent a probability(e.g., a probability of failure) as determined via application of astatistical model determined or trained by the local smart wheel serverand/or a remote server. This statistical model may be trained usinghistorical aggregated data (e.g., historical aggregated data of thelocal smart wheel sensor system or among multiple smart wheel sensorsystems). This training may be produced using machine learningtechniques (e.g., via supervised or unsupervised learning). Thesemachine learning techniques may be, for example, decision tree learning,association rule learning, artificial neural networks, deep structuredlearning, inductive logic programming, support vector machines, clusteranalysis, Bayesian networks, representation learning, similaritylearning, sparse dictionary learning, learning classifier systems, andthe like. Then, this statistical model may be applied to new or currentsmart wheel sensor data, to determine current parameter values (e.g.,probabilities of failure). Such a statistical model may account forhidden variables, interaction variables, and the like to express such aprobability. For example, these probabilities may represent aprobability of brake pad failure (e.g., brake pad erosion), a predictionof rollover (e.g., a dangerous wheel elevation) and the like.

At block 1508, the local smart wheel server may determine a thresholdvalue. In certain embodiments, these threshold values may be determinedon the fly and determined alongside a determination of whether aparameter value meets (e.g., exceeds) a threshold value. However, inother embodiments, threshold determination may be done prior to adetermination of whether a parameter value meets a threshold value.Thus, block 1508 is illustrated with dotted lines. In certainembodiments, the determination of parameter values may includeretrieving predetermined parameter values from memory or from a remoteserver.

In various embodiments, a threshold value may be determined for eachtype of parameter value. For example, there may be separate thresholdvalues for each, or a combination of, barometric pressure sensor data;acoustic sensor data; image sensor data; gas sensor data; magneticsensor data; acceleration sensor data; gyroscopic sensor data; humiditysensor data, and the like. A threshold value may characterize, forexample, a threshold amount of elevation, a threshold value of aparticular sound pattern or sound level (e.g., where meeting aparticular sound pattern or sound level would meet the threshold value),a threshold value of a particular image pattern in an image or video(e.g., where meeting a particular image pattern would meet the thresholdvalue), a threshold value (e.g., amount) of a particular type of gas, athreshold value orientation around a magnetic object (e.g., a particularorientation, such as a particular north, south, east, or west compassorientation), a threshold value of acceleration, a threshold value ofangular velocity, a threshold value of humidity, and the like.

As noted above, parameter values may be determined in accordance with astatistical analysis of a dataset of parameter values. For example, theparameter values may be aggregated across different criteria, such asdifferent times (e.g., as historical parameter values) by types ofparameter value (e.g., elevation, a sound pattern or sound level, animage pattern in an image or video, the amount of a type of gas, anorientation around a magnetic object, an amount of accelerator, anamount of angular velocity, a humidity level, and the like), differentsmart wheels, different device platforms, different vehicles, and thelike. As another example, a parameter value may represent a probabilityas determined by a statistical model. In certain embodiments, byanalyzing the aggregated data from various criteria, a threshold valuemay be determined based on detection of an outlier from the parametervalues. In certain embodiments, these outliers may determine thresholdvalues, which when met, may define an adverse condition. These outliersmay be determined in accordance with a conventional statistical analysisfor outliers. For example, a threshold value may be set as an outlieramong various probabilities (e.g., a probability value that is anoutlier).

At block 1510, a decision may be made as to whether any parameter valuesmeet any associated threshold values. As introduced above, a parameter(e.g. a parameter value) may not necessarily represent a single value,but may also represent a pattern of values and/or a range or spectrum ofvalues. If yes, the process 1500 may proceed to block 1512. If no, theprocess 1500 may return to block 1506.

At block 1508, an action may be performed in response to a parametervalue meeting a threshold value. In certain embodiments, the action maybe taken when a particular parameter value meets or exceeds a particularthreshold value. The action taken may be, for example, the production ofan alert for a driver of a vehicle or other operator of the vehicle, theapplication of an emergency brake system (e.g., activation of either prebreaking or full breaking), the activation of a particular safety ordriving system, a notification of an unsafe driving condition associatedwith a driver in an online database, and the like.

For example, as noted above, an elevation parameter value maycharacterizes an elevation of a smart wheel off of a reference point(e.g., a ground elevation) and/or relative to other smart wheels of aparticular vehicle. The meeting of the elevation parameter value with athreshold value amount of elevation may be indicative of an imminentturn over due to wheel elevation and thus provoke an action of an alertfor a driver. As another example, as noted above, an audio parametervalue may characterize a sound detectible at the rotatable component.The meeting of the audio parameter value with a threshold value of aparticular sound pattern or sound level may be indicative of imminentbrake failure due to rotor-shoe erosion noise or of tire tread erosionapproaching dangerous levels. Meeting such an audio parameter thresholdvalue may thus provoke an action of an alert for a driver or operator ofa vehicle.

Although various embodiments referred to in connection with FIG. 15 maydescribe processing of sensor data at a local smart wheel server, inother embodiments the smart wheel sensor system data may be sent to aremote smart wheel server for processing. As discussed above inconnection with FIG. 1, this processing of sensor data may be performedlocally at the local smart wheel server or performed by a combination ofboth the local smart wheel server and the remote smart wheel server.

While various embodiments of the invention have been described above, itshould be understood that they have been presented by way of exampleonly, and not by way of limitation. Likewise, the various diagrams maydepict an example architectural or configuration, which are provided toenable persons of ordinary skill in the art to understand exemplaryfeatures and functions of the invention. Such persons would understand,however, that the invention is not restricted to the illustrated examplearchitectures or configurations, but can be implemented using a varietyof alternative architectures and configurations. Additionally, as wouldbe understood by persons of ordinary skill in the art, one or morefeatures of one embodiment can be combined with one or more features ofanother embodiment described herein. Thus, the breadth and scope of thepresent disclosure should not be limited by any of the above-describedexemplary embodiments.

It is also understood that any reference to an element herein using adesignation such as “first,” “second,” and so forth does not generallylimit the quantity or order of those elements. Rather, thesedesignations can be used herein as a convenient means of distinguishingbetween two or more elements or instances of an element. Thus, areference to first and second elements does not mean that only twoelements can be employed, or that the first element must precede thesecond element in some manner.

Additionally, a person having ordinary skill in the art would understandthat information and signals can be represented using any of a varietyof different technologies and techniques. For example, data,instructions, commands, information, signals, bits and symbols, forexample, which may be referenced in the above description can berepresented by voltages, currents, electromagnetic waves, magneticfields or particles, optical fields or particles, or any combinationthereof.

A person of ordinary skill in the art would further appreciate that anyof the various illustrative logical blocks, modules, processors, means,circuits, methods and functions described in connection with the aspectsdisclosed herein can be implemented by electronic hardware (e.g., adigital implementation, an analog implementation, or a combination ofthe two, which can be designed using source coding or some othertechnique), various forms of program or design code incorporatinginstructions (which can be referred to herein, for convenience, as“software” or a “software module), or combinations of both. To clearlyillustrate this interchangeability of hardware and software, variousillustrative components, blocks, modules, circuits, and steps have beendescribed above generally in terms of their functionality. Whether suchfunctionality is implemented as hardware, firmware or software, or acombination of these technique, depends upon the particular applicationand design constraints imposed on the overall system. Skilled artisanscan implement the described functionality in various ways for eachparticular application, but such implementation decisions should not beinterpreted as causing a departure from the scope of the presentdisclosure.

Furthermore, a person of ordinary skill in the art would understand thatvarious illustrative logical blocks, modules, devices, components andcircuits described herein can be implemented within or performed by anintegrated circuit (IC) that can include a general purpose processor, adigital signal processor (DSP), an application specific integratedcircuit (ASIC), a field programmable gate array (FPGA) or otherprogrammable logic device, or any combination thereof. The logicalblocks, modules, and circuits can further include antennas and/ortransceivers to communicate with various components within the networkor within the device. A general purpose processor can be amicroprocessor, but in the alternative, the processor can be anyconventional processor, controller, or state machine. A processor canalso be implemented as a combination of computing devices, e.g., acombination of a DSP and a microprocessor, a plurality ofmicroprocessors, one or more microprocessors in conjunction with a DSPcore, or any other suitable configuration to perform the functionsdescribed herein.

If implemented in software, the functions can be stored as one or moreinstructions or code on a computer-readable medium. Thus, the steps of amethod or algorithm disclosed herein can be implemented as softwarestored on a computer-readable medium. Computer-readable media includesboth computer storage media and communication media including any mediumthat can be enabled to transfer a computer program or code from oneplace to another. A storage media can be any available media that can beaccessed by a computer. By way of example, and not limitation, suchcomputer-readable media can include RAM, ROM, EEPROM, CD-ROM or otheroptical disk storage, magnetic disk storage or other magnetic storagedevices, or any other medium that can be used to store desired programcode in the form of instructions or data structures and that can beaccessed by a computer.

In this document, the term “module” as used herein, refers to software,firmware, hardware, and any combination of these elements for performingthe associated functions described herein. Additionally, for purpose ofdiscussion, the various modules are described as discrete modules;however, as would be apparent to one of ordinary skill in the art, twoor more modules may be combined to form a single module that performsthe associated functions according embodiments of the invention.

Additionally, memory or other storage, as well as communicationcomponents, may be employed in embodiments of the invention. It will beappreciated that, for clarity purposes, the above description hasdescribed embodiments of the invention with reference to differentfunctional units and processors. However, it will be apparent that anysuitable distribution of functionality between different functionalunits, processing logic elements or domains may be used withoutdetracting from the invention. For example, functionality illustrated tobe performed by separate processing logic elements, or controllers, maybe performed by the same processing logic element, or controller. Hence,references to specific functional units are only references to asuitable means for providing the described functionality, rather thanindicative of a strict logical or physical structure or organization.

Various modifications to the implementations described in thisdisclosure will be readily apparent to those skilled in the art, and thegeneral principles defined herein can be applied to otherimplementations without departing from the scope of this disclosure.Thus, the disclosure is not intended to be limited to theimplementations shown herein, but is to be accorded the widest scopeconsistent with the novel features and principles disclosed herein, asrecited in the claims below.

What is claimed is:
 1. An energy harvester system, comprising: asubstrate comprising: a first surface configured to contact andinterface with a surface of a wheel, and a second surface opposite thefirst surface; a piezoelectric component configured to produce energy inresponse to mechanical strain imparted on the piezoelectric component,wherein a portion of the piezoelectric component is attached to a firstportion of the second surface, the second surface comprising a secondportion that is configured to contact the piezoelectric component whenmechanical strain is imparted on the piezoelectric component but doesnot contact the piezoelectric component when no mechanical strain isimparted on the piezoelectric component, and wherein the piezoelectriccomponent is configured to deform while experiencing the mechanicalstrain so as to contact the second portion of the second surface; and aninterconnect conductively coupled to the piezoelectric component, theinterconnect being configured to conduct electrical energy from thepiezoelectric component to a device coupled to the wheel.
 2. The systemof claim 1, wherein the piezoelectric component comprises multiplelayers.
 3. The system of claim 2, wherein the piezoelectric componentcomprises: a tensile load backing layer, a piezoelectric material layer,and an electrode layer.
 4. The system of claim 3, wherein the electrodelayer comprises an electrode configured to connect to the interconnect.5. The system of claim 3, wherein the electrode is formed in a meshconfiguration.
 6. The system of claim 3, wherein the electrode layer iscloser to the second surface than the tensile load backing layer.
 7. Thesystem of claim 3, wherein the electrode layer comprises an elongatedelectrode that traverses a two dimensional space.
 8. The system of claim1, wherein the first surface is curved in three dimensions along alength, a width, and a height of the substrate.
 9. A system, comprising:a wheel comprising a staging surface formed therein; and a piezoelectriccomponent configured to produce energy in response to mechanical strain,wherein the piezoelectric component is flat and fixed to a first portionof the staging surface, the staging surface comprising a second portionthat is configured to contact the piezoelectric component whenmechanical strain is imparted on the piezoelectric component but doesnot contact the piezoelectric component when no mechanical strain isimparted on the piezoelectric component, and wherein the piezoelectriccomponent is configured to deform and contact the second portion of thestaging surface while experiencing the mechanical strain.
 10. The systemof claim 9, wherein the wheel comprises a rim, and wherein the stagingsurface is part of a depression along the rim.
 11. The system of claim9, wherein the piezoelectric component comprises a piezoelectricmaterial layer between two electrode layers.
 12. The system of claim 11,wherein the two electrode layers comprise different mesh structures. 13.The system of claim 9, wherein the wheel has a spherical shape.
 14. Thesystem of claim 9, wherein the piezoelectric component comprises apiezoelectric material that is least one of: a crystal and semiconductormaterial or a polymer and organic material.
 15. The system of claim 9,wherein the wheel comprises an airless tire and the staging surface isalong a spoke of the airless tire.
 16. A method, comprising: rotating awheel, wherein the wheel comprises a staging surface formed in thewheel; deforming a piezoelectric component, wherein the piezoelectriccomponent configured to produce energy in response to mechanical strain,wherein the piezoelectric component is flat and fixed to a first portionof the staging surface, and wherein the piezoelectric component isconfigured to deform and contact a second portion of staging surfacewhile experiencing the mechanical strain but does not contact the secondportion of the staging surface when not experiencing the mechanicalstrain; and powering a device located on the wheel using the energy. 17.The method of claim 16, further comprising: receiving, at a processorlocated within a vehicle body, sensor data from the device, wherein thedevice is configured to produce the sensor data while disposed on thewheel; determining a parameter value based on the sensor data; andperforming an action based on the parameter value meeting a thresholdvalue.
 18. The method of claim 17, wherein the parameter value is basedon the sensor data and data received from a remote server.
 19. Themethod of claim 17, wherein the device is configured to send the sensordata to the processor via a wireless connection.
 20. The method of claim16, wherein the piezoelectric component is configured to contact asurface on which the wheel is configured to rotate.